MC33394DH Freescale Semiconductor, MC33394DH Datasheet - Page 6

• Manufacturer Part Number: MC33394DH
• Description: IC POWER SUPPLY MULT-OUT 44-HSOP
• Manufacturer: Freescale Semiconductor

Specifications of MC33394DH

• Applications: Motorola MPC55x, MPC56x Microprocessors
• Interface: SPI Serial
• Voltage - Supply: 4 V ~ 26.5 V
• Package / Case: 44-BSOP (0.433", 11.00mm Width) Exposed Pad
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

1. MAXIMUM RATINGS
Voltage parameters are absolute voltages referenced to ground.)
2. RECOMMENDED OPERATING CONDITIONS (
Supply Voltage (VBAT), Load Dump
Supply Voltage (KA_VBAT, VIGN), Load Dump
Supply Voltages (VDDH, VPP, VDD3_3, VDDL, VKAM)
Supply Voltages (VREF1, VREF2, VREF3, VSEN)
CANL, CANH (0<VBAT<18 VDC no time limit)
ESD Voltage
CANLesd, CANHesd
CANLesd, CANHesd
CANLtransient, CANHtransient
/SLEEP
REGON, VPP_EN, /HRESET, /PORESET, /PRERESET, HRT, DO, DI, CS, SCLK
CANTXD, CANRXD
Operational Package Temperature [Ambient Temperature]
Storage Temperature
Power Dissipation (T A = 125 _ C)
44 HSOP
44 QFN
54 SOICW–EP
Lead Soldering Temperature
Maximum Junction Temperature
R JA , Thermal Resistance, Junction to Ambient (44 HSOP)
R JC , Thermal Resistance, Junction to Case (44 HSOP)
R JB , Thermal Resistance, Junction to Base (44 HSOP)
R JA , Thermal Resistance, Junction to Ambient (44 QFN)
R JC , Thermal Resistance, Junction to Case (44 QFN)
R JB , Thermal Resistance, Junction to Base (44 QFN)
R JA , Thermal Resistance, Junction to Ambient (54 SOICW–EP)
R JC , Thermal Resistance, Junction to Case (54 SOICW–EP)
R JB , Thermal Resistance, Junction to Base (54 SOICW–EP)
Supply Voltages (VBAT, KA_VBAT)
Switching Regulator Output Current (I VPRE )
VDDH Output Current
VDD3_3 Output Current
VDDL_B Pass Transistor Base Drive Current
VPP Output Current
VREF Output Current
VSEN Output Current
VKAM Standby Output Current (normal mode of operation)
VKAM Standby Output Current (standby mode of operation)
Human Body Model all pins
Machine Model all pins
6
1. Human body model: C = 100 pF, R = 1.5 k .
2. Machine model: C = 200 pF, R = 10
3. The waveforms of the applied transients is in accordance with ”ISO 7637 part 1” test pulses 1, 2, 3a and 3b.
4. Maximum power dissipation at indicated junction temperature.
5. Lead soldering temperature limit is for 10 seconds maximum duration; contact Motorola Sales Office for device immersion soldering
6. Thermal resistance measured in accordance with EIA/JESD51–2.
7. Theoretical thermal resistance from the die junction to the exposed pad.
8. Thermal resistance measured in accordance with JESD51–8.
1. See Typical Application Diagram in Figure 1.
V; in case of a discharge from pin CANH to Vcc: –150 V < CANH transient < +150 V.
time/temperature limits.
(Maximum Ratings indicate sustained limits beyond which damage to the device may occur.
Freescale Semiconductor, Inc.
For More Information On This Product,
Parameter
and L = 0.75 H. In case of a discharge from pin CANL to pin GND: – 100 V < CANL transient < +100
Parameter
Go to: www.freescale.com
All voltages are with respect to ground unless otherwise noted)
(Note 1)
33394
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 3)
(Note 4)
(Note 4)
(Note 4)
(Note 5)
(Note 6)
(Note 7)
(Note 8)
(Note 6)
(Note 7)
(Note 8)
(Note 6)
(Note 7)
(Note 8)
4.0 to 26.5
–200
–200
–200
0 to 400
0 to 120
0 to 150
0 to 100
0 to 125
Min.
–0.3
–0.3
–2.0
–2.0
–4.0
–0.3
–0.3
0 to 1.2
–18
–18
–18
–40
–65
0 to 40
0 to 60
0 to 12
Value
+26.5
Max.
+200
+200
+200
+125
+150
+150
+5.8
+2.0
+4.0
+7.0
+7.0
+45
+45
+18
+45
260
8.3
5.0
5.0
0.2
1.7
5.0
1.2
8.1
41
77
52
3
Unit
mA
mA
mA
mA
mA
mA
mA
mA
V
A
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
_ C
kV
kV
W
W
W
V
V
V
V
V
V
V
V
V
V
V
C
C
C