MC33394DH Freescale Semiconductor, MC33394DH Datasheet - Page 40

• Manufacturer Part Number: MC33394DH
• Description: IC POWER SUPPLY MULT-OUT 44-HSOP
• Manufacturer: Freescale Semiconductor

Specifications of MC33394DH

• Applications: Motorola MPC55x, MPC56x Microprocessors
• Interface: SPI Serial
• Voltage - Supply: 4 V ~ 26.5 V
• Package / Case: 44-BSOP (0.433", 11.00mm Width) Exposed Pad
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

40
2X
44X
0.1
0.1
PREFERRED BACKSIDE PIN 1 INDEX
6.85
6.55
0.75
0.50
C
C
A
A B
9
B
33
23
DETAIL M
22
34
44X
VIEW M–M
PREFERRED CORNER CONFIGURATION
0.065
0.015
PIN 1
INDEX AREA
0.1
6.85
6.55
9
DETAIL T
C
Freescale Semiconductor, Inc.
A B
For More Information On This Product,
DETAIL N
44
12
(0.25)
4
44X
11
1
N
2X
0.37
0.23
Go to: www.freescale.com
0.475
0.425
0.05
0.1
PACKAGE DIMENSIONS
(3.53)
0.65
0.1
DETAIL M
PIN 1 IDENTIFIER
R
EXPOSED DIE
ATTACH PAD
BACKSIDE PIN 1 INDEX OPTION
M
M
0.25
0.15
(45 )
PLASTIC PACKAGE
C
40X
C
C
CASE 1310–01
44–LEAD QFN
G
A B
FC SUFFIX
DETAIL M
33394
ISSUE D
3.4
3.3
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
M
M
CORNER CONFIGURATION OPTION
BACKSIDE
PIN 1 INDEX
1.0 1.00
0.8 0.75
0.05
0.00
NOTES:
0.60
0.24
DETAIL N
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
4. CORNER CHAMFER MAY NOT BE PRESENT.
5. COPLANARITY APPLIES TO LEADS, CORNER
6. FOR ANVIL SINGULATED QFN PACKAGES,
Y14.5M, 1994.
PACKAGE IS: HF–PQFP–N.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
LEADS AND DIE ATTACH PAD.
MAXIMUM DRAFT ANGLE IS 12 .
4
VIEW ROTATED 90 CLOCKWISE
PREFERRED BACKSIDE PIN 1 INDEX
2X 0.39
DETAIL G
0.60
0.24
0.31
(0.65)
(0.325)
DETAIL T
C
0.1
0.05
SEATING PLANE
2X
(90 )
C
C
0.1
0.0
5