NCP382LMN10AATXG ON Semiconductor, NCP382LMN10AATXG Datasheet - Page 3

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NCP382LMN10AATXG

Manufacturer Part Number
NCP382LMN10AATXG
Description
IC DISTR LOAD SWITCH 2CH 8DFN
Manufacturer
ON Semiconductor
Datasheets

Specifications of NCP382LMN10AATXG

Lead Free Status / Rohs Status
Compliant
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
3. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.
4. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
Human Body Model (HBM) ESD Rating are (Note 2)
Machine Model (MM) ESD Rating are (Note 2)
Latch−up protection (Note 3)
MAXIMUM RATINGS
From IN to OUT1, From IN to OUT2 Supply Voltage (Note 1)
IN, OUT1,OUT2, EN1, EN2, FLAG1, FLAG2 (Note 1)
FLAG1, FLAG2 sink current
ESD Withstand Voltage (IEC 61000−4−2) (output only, when
bypassed with 1.0 mF capacitor minimum)
Maximum Junction Temperature (Note 4)
Storage Temperature Range
Moisture Sensitivity (Note 5)
Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.
− Pins IN, OUT1, OUT2, FLAG1, FLAG2
− EN1, EN2
Rating
http://onsemi.com
V
3
IN,
V
OUT1,
V
V
IN ,
FLAG1
ESD HBM
ESD IEC
ESD MM
V
Symbol
V
OUT1
T
I
MSL
OUT2,
SINK
LU
STG
T
, V
J
,V
FLAG2
V
OUT2
EN1,
V
EN2,
15 Air, 8 contact
−40 to + TSD
−40 to + 150
−7.0 to +7.0
−0.3 to +7.0
Level 1
Value
2000
200
100
2
Unit
mA
mA
kV
°C
°C
V
V
V
V

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