LTC4310IMS-2#PBF Linear Technology, LTC4310IMS-2#PBF Datasheet - Page 18

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LTC4310IMS-2#PBF

Manufacturer Part Number
LTC4310IMS-2#PBF
Description
IC I2C ISOLATOR SMBUS 10MSOP
Manufacturer
Linear Technology
Type
Hot-Swap I²C Isolatorsr
Datasheet

Specifications of LTC4310IMS-2#PBF

Tx/rx Type
I²C Logic
Capacitance - Input
10pF
Voltage - Supply
3 V ~ 5.5 V
Current - Supply
7mA
Mounting Type
Surface Mount
Package / Case
10-MSOP, Micro10™, 10-uMAX, 10-uSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Delay Time
-

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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC4310IMS-2#PBFLTC4310IMS-2
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC4310IMS-2#PBF
Manufacturer:
Linear Technology
Quantity:
135
Company:
Part Number:
LTC4310IMS-2#PBF/CMS
Manufacturer:
LT
Quantity:
4 242
3.50 ±0.05
LTC4310-1/LTC4310-2
package DescripTion

2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
0.25 ± 0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
1.65 ±0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
TOP AND BOTTOM OF PACKAGE
(2 SIDES)
2.38 ±0.05
(2 SIDES)
0.50
BSC
0.675 ±0.05
PACKAGE
OUTLINE
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
(SEE NOTE 6)
TOP MARK
PIN 1
0.200 REF
DD Package
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD) DFN 1103
431012f

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