MAX9249GCM/V+ Maxim Integrated Products, MAX9249GCM/V+ Datasheet - Page 2

• Manufacturer Part Number: MAX9249GCM/V+
• Description: IC SERIALIZER GMSL LVDS 48TQFP
• Manufacturer: Maxim Integrated Products

Specifications of MAX9249GCM/V+

• Function: Serializer
• Data Rate: 2.5Gbs
• Input Type: LVDS
• Output Type: Serial
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Outputs: -
• Number Of Inputs: -

DC ELECTRICAL CHARACTERISTICS
(V
+105NC, unless otherwise noted. Differential input voltage |V
- |V
Gigabit Multimedia Serial Link
Serializer with LVDS System Interface
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND ....................................................-0.5V to +1.9V
LVDSVDD to AGND ..............................................-0.5V to +3.9V
DVDD to GND ......................................................-0.5V to +1.9V
IOVDD to GND .....................................................-0.5V to +3.9V
Any Ground to Any Ground .................................-0.5V to +0.5V
RXIN_ _, RXCLKIN_ to AGND ..............................-0.5V to +3.9V
OUT+, OUT- to AGND .........................................-0.5V to +1.9V
LMN_ to GND (15mA current limit) ......................-0.5V to +3.9V
All Other Pins to Any Ground .............. -0.5V to (V
OUT+, OUT- Short Circuit to Ground or Supply .......Continuous
Continuous Power Dissipation (
ESD Protection
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
PACKAGE THERMAL CHARACTERISTICS (Note 1)
48 TQFP-EP
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
SINGLE-ENDED INPUTS (PWDN, SSEN, BWS, DRS, MS, CDS, AUTOS, SD/CNTL0, SCK, WS, CNTL_)
High-Level Input Voltage
Low-Level Input Voltage
Input Current
Input Clamp Voltage
SINGLE-ENDED OUTPUT (INT)
High-Level Output Voltage
Low-Level Output Voltage
Output Short-Circuit Current
2
DVDD
48-Pin TQFP (derate 36.2mW/NC above +70NC) ....2898.6mW
Human Body Model (R
(RXIN_ _, RXCLKIN_, OUT+, OUT-) to GND ...................±8kV
All Other Pins to GND ......................................................±3kV
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
ID
______________________________________________________________________________________
/2|. Typical values are at V
= V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
AVDD
= 1.7V to 1.9V, V
D
= 1.5kω, C
T A
DVDD
= +70NC)
LVDSVDD
SYMBOL
= V
S
V
V
V
V
V
I
= 100pF)
I
OH1
IN1
OL1
OS
IH1
IL1
AVDD
CL
JC
).................2NC/W
= 3.0V to 3.6V, V
JA
= V
) .......27.6NC/W
PWDN, SSEN, BWS, DRS, MS, CDS, AUTOS
SD/CNTL0, SCK, WS, CNTL_
V
I
I
I
V
IOVDD
CL
OH
OL
IN
O
IOVDD
= 0V
= -18mA
= 2mA
= 0 to V
= -2mA
+ 0.5V)
= 1.8V, V
IOVDD
ID
| = 0.1V to 1.2V, input common-mode voltage V
IOVDD
CONDITIONS
V
V
IOVDD
IOVDD
LVDSVDD
IEC 61000-4-2 (R
ISO 10605 (R
Operating Temperature Range ........................ -40NC to +105NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
= 1.7V to 3.6V, R
Contact Discharge
(RXIN_ _, RXCLKIN_) to GND .........................................±4kV
(OUT+, OUT-) to GND ...................................................±10kV
(RXIN_ _, RXCLKIN_) to GND .........................................±8kV
(OUT+, OUT-) to GND ...................................................±12kV
Contact Discharge
(RXIN_ _, RXCLKIN_) to GND .........................................±6kV
(OUT+, OUT-) to GND ...................................................±10kV
(RXIN_ _, RXCLKIN_) to GND .......................................±20kV
(OUT+, OUT-) to GND ...................................................±30kV
Air Discharge
Air Discharge
= 3.0V to 3.6V
= 1.7V to 1.9V
= 3.3V, T
D
= 2kω, C
A
D
= +25NC.)
L
= 330ω, C
= 100I ±1% (differential), T
S
V
V
V
= 330pF)
0.65 x
IOVDD
IOVDD
0.7 x
IOVDD
MIN
-10
0.2
16
3
S
= 150pF)
-
TYP
35
12
CM
V
0.35 x
MAX
= |V
IOVDD
+10
-1.5
0.2
64
21
A
ID
= -40NC to
/2| to 2.4V
UNITS
mA
FA
V
V
V
V
V