MCP23S09-E/MG Microchip Technology, MCP23S09-E/MG Datasheet - Page 29

• Manufacturer Part Number: MCP23S09-E/MG
• Description: IC I/O EXPANDER SPI 8B 16QFN
• Manufacturer: Microchip Technology
• Type: I/O Expanderr

Specifications of MCP23S09-E/MG

• Package / Case: 16-QFN
• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Chip Configuration: 8 Bit
• Bus Frequency: 10MHz
• Ic Interface Type: SPI
• No. Of I/o's: 8
• Supply Voltage Range: 1.8V To 5.5V
• Digital Ic Case Style: QFN
• No. Of Pins: 16
• Interface Type: SPI
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

2.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on RESET with respect to V
Voltage on all other pins with respect to V
Voltage on GPIO Pins: ................................................................................................................................. -0.6V to 5.5V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sunk by any Output pin (V
© 2009 Microchip Technology Inc.
†
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
ELECTRICAL CHARACTERISTICS
Power dissipation is calculated as follows:
Pdis = V
DD
with respect to V
DD
IK
OK
(V
x {I
DD
SS
I
(V
DD
< 0 or V
pin ..............................................................................................................................125 mA
O
pin ...........................................................................................................................200 mA
- ∑ I
< 0 or V
SS
OH
I
> V
......................................................................................................... -0.3V to +7.0V
SS
} + ∑ {(V
(†)
O
..................................................................................................... -0.3V to +14V
DD
> V
SS
)...................................................................................................................... ±20 mA
DD
(except V
DD
) .............................................................................................................. ±20 mA
-V
OH
DD
) x I
DD
= 1.8V) ..............................................................................10 mA
OH
and GPIOA/B) ..................................... -0.6V to (V
} + ∑(V
MCP23009/MCP23S09
OL
x I
OL
)
DS22121B-page 29
DD
+ 0.6V)