MCP23S08-E/SO Microchip Technology, MCP23S08-E/SO Datasheet - Page 35

• Manufacturer Part Number: MCP23S08-E/SO
• Description: IC I/O EXPANDER SPI 8B 18SOIC
• Manufacturer: Microchip Technology

Specifications of MCP23S08-E/SO

• Package / Case: 18-SOIC (7.5mm Width)
• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: MCP23S08
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 1.7 MHz
• Mounting Style: SMD/SMT
• Output Current: 25 mA
• Output Voltage: 1.8 V to 4.5 V
• Chip Configuration: 8 Bit
• Bus Frequency: 10MHz
• Ic Interface Type: Serial, SPI
• No. Of I/o's: 8
• Supply Voltage Range: 1.8V To 5.5V
• Digital Ic Case Style: SOIC
• No. Of Pins: 18
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Delay Time: 50ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
E1
A2
E
Units
A2
A1
E1
L1
D
N
A
E
e
h
L
c
b
MCP23008/MCP23S08
MIN
2.05
0.10
0.25
0.40
0.20
0.31
L
0°
5°
5°
–
h
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
h
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS21919E-page 35
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