MCP23S08-E/SO Microchip Technology, MCP23S08-E/SO Datasheet - Page 34

• Manufacturer Part Number: MCP23S08-E/SO
• Description: IC I/O EXPANDER SPI 8B 18SOIC
• Manufacturer: Microchip Technology

Specifications of MCP23S08-E/SO

• Package / Case: 18-SOIC (7.5mm Width)
• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: MCP23S08
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 1.7 MHz
• Mounting Style: SMD/SMT
• Output Current: 25 mA
• Output Voltage: 1.8 V to 4.5 V
• Chip Configuration: 8 Bit
• Bus Frequency: 10MHz
• Ic Interface Type: Serial, SPI
• No. Of I/o's: 8
• Supply Voltage Range: 1.8V To 5.5V
• Digital Ic Case Style: SOIC
• No. Of Pins: 18
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Delay Time: 50ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP23008/MCP23S08
DS21919E-page 34
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
1
N
2
b
b1
3
D
Dimension Limits
Units
e
A2
A1
E1
eB
b1
N
D
A
E
b
e
L
c
E1
A2
.015
.300
.240
.880
.008
.045
.014
MIN
.115
.115
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.900
.130
.010
.060
.018
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
eB
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
–
c