SCAN92LV090VEH/NOPB National Semiconductor, SCAN92LV090VEH/NOPB Datasheet - Page 7

IC TXRX LVDS 9CH W/SCAN 64LQFP

SCAN92LV090VEH/NOPB

Manufacturer Part Number
SCAN92LV090VEH/NOPB
Description
IC TXRX LVDS 9CH W/SCAN 64LQFP
Manufacturer
National Semiconductor
Series
SCANr
Type
Transceiverr
Datasheet

Specifications of SCAN92LV090VEH/NOPB

Number Of Drivers/receivers
9/9
Protocol
IEEE 1149.1
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*SCAN92LV090VEH
*SCAN92LV090VEH/NOPB
SCAN92LV090VEH

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SCAN92LV090VEH/NOPB
Manufacturer:
Texas Instruments
Quantity:
10 000
Applications Information
General application guidelines and hints may be found in the
following application notes: AN-808, AN-1108, AN-977,
AN-971, and AN-903.
There are a few common practices which should be implied
when designing PCB for Bus LVDS signaling. Recommended
practices are:
MEDIA (CONNECTOR or BACKPLANE) SELECTION:
Test Circuits and Timing Waveforms
Use at least 4 PCB board layer (Bus LVDS signals,
ground, power and TTL signals).
Keep drivers and receivers as close to the (Bus LVDS port
side) connector as possible.
Bypass each Bus LVDS device and also use distributed
bulk capacitance between power planes. Surface mount
capacitors placed close to power and ground pins work
best. Two or three high frequency, multi-layer ceramic
(MLC) surface mount (0.1 µF, 0.01 µF, 0.001 µF) in parallel
should be used between each V
capacitors should be as close as possible to the V
Multiple vias should be used to connect V
planes to the pads of the by-pass capacitors.
In addition, randomly distributed by-pass capacitors
should be used.
Use the termination resistor which best matches the
differential impedance of your transmission line.
Leave unused Bus LVDS receiver inputs open (floating).
Limit traces on unused inputs to <0.5 inches.
Isolate TTL signals from Bus LVDS signals
Use controlled impedance media. The backplane and
connectors should have a matched differential
impedance.
FIGURE 2. Differential Driver Propagation Delay and Transition Time Test Circuit
CC
and ground. The
FIGURE 1. Differential Driver DC Test Circuit
CC
and Ground
CC
pin.
7
X = High or Low logic state
L = Low state
Z = High impedance state
H = High state
DE
H
H
H
L
LOOP BACK MODE
MODE SELECTED
RECEIVER MODE
TRI-STATE MODE
DRIVER MODE
RE
H
L
L
L
TABLE 2. Transmitter Mode
TABLE 1. Functional Table
INPUTS
0.8V< D
TABLE 3. Receiver Mode
−100 mV < V
INPUTS
H (> +100 mV)
L (< −100 mV)
(RI+) – (RI−)
D
10124204
H
X
L
IN
IN
<2.0V
mV
X
10124203
ID
< +100
DE
H
H
L
L
OUTPU
DO+
H
X
Z
OUTPUTS
L
H
X
T
L
Z
www.national.com
DO−
RE
H
X
H
H
L
Z
L
L

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