MPC8572EPXAVND Freescale Semiconductor, MPC8572EPXAVND Datasheet - Page 99

• Manufacturer Part Number: MPC8572EPXAVND
• Description: MPU POWERQUICC III 1023-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8572EPXAVND

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 1.5GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 1023-FCPBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

18 Package Description
This section describes package parameters, pin assignments, and dimensions.
18.1
The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023
flip chip plastic ball grid array (FC-PBGA).
Freescale Semiconductor
Package outline
Interconnects
Ball Pitch
Ball Diameter (Typical)
Solder Balls
Solder Balls (Lead-Free)
Package Parameters for the MPC8572E FC-PBGA
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
1023
1 mm
0.6 mm
63% Sn
37% Pb
96.5% Sn
33 mm × 33 mm
3.5% Ag
Package Description
99