XCV812E-7FG900C Xilinx Inc, XCV812E-7FG900C Datasheet - Page 111

• Manufacturer Part Number: XCV812E-7FG900C
• Description: IC FPGA 1.8V C-TEMP 900-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-7FG900C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 556
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 900-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 5:
DS025-4 (v1.6) July 17, 2002
Bank
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
R
FG900 Fine-Pitch BGA Package — XCV812E
Description
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_0
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_1
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCO_2
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
W11
W12
W19
W20
M15
M14
M13
M18
M17
M16
M28
V16
V17
V18
Y11
Y12
Y19
Y20
H14
C12
B25
C19
H17
P23
R20
P20
R19
L15
L14
L17
L16
F29
Pin
B6
www.xilinx.com
1-800-255-7778
Table 5:
Bank
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
FG900 Fine-Pitch BGA Package — XCV812E
Description
VCCO_2
VCCO_2
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_3
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_4
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_5
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
VCCO_6
Module 4 of 4
AE29
AH19
AC17
AC14
AH12
AJ25
W28
W18
W17
W16
W15
W14
W13
N19
P19
U23
U20
V19
U19
Y17
Y16
Y15
Y14
AE2
V12
U12
U11
T20
T19
AJ6
T12
T11
Pin
W3
U8
35