EP1S25F1020I6 Altera, EP1S25F1020I6 Datasheet - Page 3

• Manufacturer Part Number: EP1S25F1020I6
• Description: IC STRATIX FPGA 25K LE 1020-FBGA
• Manufacturer: Altera
• Series: Stratix®r

Specifications of EP1S25F1020I6

• Number Of Logic Elements/cells: 25660
• Number Of Labs/clbs: 2566
• Total Ram Bits: 1944576
• Number Of I /o: 706
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 1020-FBGA
• Family Name: Stratix
• Number Of Logic Blocks/elements: 25660
• # I/os (max): 706
• Frequency (max): 450.05MHz
• Process Technology: 0.13um (CMOS)
• Operating Supply Voltage (typ): 1.5V
• Logic Cells: 25660
• Ram Bits: 1944576
• Operating Supply Voltage (min): 1.425V
• Operating Supply Voltage (max): 1.575V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 1020
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Not Compliant

Altera Corporation
Chapter
2
3
4
September 2004, v1.1
January 2005, v1.2
January 2006, v3.4
April 2003, v1.0
July 2003, v2.0
July 2005, v1.3
July 2005, v3.3
Date/Version
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Added reference on page 2-73 to Figures 2-50 and 2-51 for
connections.
Updated ranges for EPLL post-scale and pre-scale dividers on page
2-85.
Updated PLL Reconfiguration frequency from 25 to 22 MHz on page
2-87.
New requirement to assert are set signal each PLL when it has to re-
acquire lock on either a new clock after loss of lock (page 2-96).
Updated max input frequency for
Table 2-24.
Renamed impedance matching to series termination throughout.
Updated naming convention for DQS pins on page 2-112 to match pin
tables.
Added DDR SDRAM Performance Specification on page 2-117.
Added external reference resistor values for terminator technology
(page 2-136).
Added Terminator Technology Specification on pages 2-137 and 2-
138.
Updated Tables 2-45 to 2-49 to reflect PLL cross-bank support for
high speed differential channels at full speed.
Wire bond package performance specification for “high” speed
channels was increased to 624 Mbps from 462 Mbps throughout
chapter.
Updated
Updated
Updated
Updated
Updated limits for JTAG chain of devices.
Added new section,
Detection” on page
Updated description of
No new changes in Stratix Device Handbook v2.0.
Added
Updated
Updated
Updated
Updated
Added
Table
Table
“IEEE Std. 1149.1 (JTAG) Boundary-Scan Support”
“Operating Modes”
“Temperature Sensing Diode”
“Configuration”
Tables 4–6
Tables 4–103
Tables 4–114
Table
4–135.
4–130.
4–129.
3–12.
“Stratix Automated Single Event Upset (SEU)
and 4–30.
“Custom-Built Circuitry” on page
through 4–108.
through 4–124.
section.
Changes Made
section.
CLK[1,3,8,10]
Stratix Device Family Data Sheet
section.
from 462 to 500,
3–13.
Section I–3
RCLK
section.