ADSP-21261SKSTZ150 Analog Devices Inc, ADSP-21261SKSTZ150 Datasheet - Page 44

• Manufacturer Part Number: ADSP-21261SKSTZ150
• Description: IC DSP 32BIT 150MHZ 144LQFP
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21261SKSTZ150

• Interface: DAI, SPI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (384 kB)
• On-chip Ram: 128kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• No. Of Bits: 32 / 40
• Frequency: 150MHz
• Supply Voltage: 1.2V
• Embedded Interface Type: Serial
• Supply Voltage Range: 1.14V To 1.26V
• Operating Temperature Range: 0°C To +70°C
• Digital Ic: RoHS Compliant
• Device Core Size: 32/40Bit
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 128KB
• Program Memory Size: 384KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Package: 144LQFP
• Numeric And Arithmetic Format: Floating-Point
• Maximum Speed: 150 MHz
• Device Million Instructions Per Second: 150 MIPS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21261
SURFACE MOUNT DESIGN
Table 36
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 36. BGA Data for Use with Surface Mount Design
ORDERING GUIDE
1
2
© 2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Package
136-Ball Mini-BGA
(BC-136-3)
Model
ADSP-21261SKBC-150
ADSP-21261SKBCZ150
ADSP-21261SKSTZ150
Ranges shown represent ambient temperature.
Z = Pb-free part.
is provided as an aid to PCB design. For industry-
Ball Attach
Type
Solder Mask
Defined
2
2
Temperature
Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
1
Solder Mask
Opening
0.40 mm
diameter
D04932-0-3/06(0)
Instruction
Rate
150 MHz
150 MHz
150 MHz
Rev. 0 | Page 44 of 44 | March 2006
Ball Pad
Size
0.53 mm
diameter
On-Chip
SRAM
1M bit
1M bit
1M bit
ROM
3M bit 1.2 V Internal
3M bit 1.2 V Internal
3M bit 1.2 V Internal
Operating
Voltage
3.3 V External
3.3 V External
3.3 V External
Package
Description
136-Ball BGA
136-Ball BGA
144-Lead LQFP ST-144-2
Package
Option
BC-136-3
BC-136-3