ADSP-21261SKSTZ150 Analog Devices Inc, ADSP-21261SKSTZ150 Datasheet - Page 43

IC DSP 32BIT 150MHZ 144LQFP

ADSP-21261SKSTZ150

Manufacturer Part Number
ADSP-21261SKSTZ150
Description
IC DSP 32BIT 150MHZ 144LQFP
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Fixed/Floating Pointr

Specifications of ADSP-21261SKSTZ150

Interface
DAI, SPI
Clock Rate
150MHz
Non-volatile Memory
ROM (384 kB)
On-chip Ram
128kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
144-LQFP
No. Of Bits
32 / 40
Frequency
150MHz
Supply Voltage
1.2V
Embedded Interface Type
Serial
Supply Voltage Range
1.14V To 1.26V
Operating Temperature Range
0°C To +70°C
Digital Ic
RoHS Compliant
Device Core Size
32/40Bit
Architecture
Super Harvard
Format
Floating Point
Clock Freq (max)
150MHz
Mips
150
Device Input Clock Speed
150MHz
Ram Size
128KB
Program Memory Size
384KB
Operating Supply Voltage (typ)
1.2/3.3V
Operating Supply Voltage (min)
1.14/3.13V
Operating Supply Voltage (max)
1.26/3.47V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Package
144LQFP
Numeric And Arithmetic Format
Floating-Point
Maximum Speed
150 MHz
Device Million Instructions Per Second
150 MIPS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21261SKSTZ150
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
ADSP-21261SKSTZ150
Manufacturer:
ADI/亚德诺
Quantity:
20 000
PACKAGE DIMENSIONS
The ADSP-21261 is available in a 136-ball BGA package and a
144-lead LQFP package shown in
0.08 MAX (LEAD
COPLANARITY)
0.75
0.60 TYP
0.45
0.27
0.22
0.17
SEATING
PLANE
TYP
0.15
0.05
MAX
1.70
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
4. CENTER DIMENSIONS ARE NOMINAL.
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
THE BALL DIAMETER.
DETAIL A
1.60 MAX
PIN A1 INDICATOR
1.45
1.40
1.35
12.00 BSC SQ
TOP VIEW
Figure 35
0.50
BSC
TYP
(LEAD
PITCH)
and
Figure 35. 136-Ball Mini-BGA [CSP_BGA] (BC-136-3)
Figure
Rev. 0 | Page 43 of 44 | March 2006
DETAIL A
3 6
1
DETAIL A
144
36.
Figure 36. 144-Lead LQFP (ST-144-2)
37
PIN 1 INDICATOR
BSC
BSC
0.80
0.80
TYP
TYP
TOP VIEW (PINS DOWN)
22.00 BSC SQ
A
B
C
D
G
H
K
M
N
E
F
J
L
P
14
13
12
0.25
MIN
20.00 BSC SQ
11
10 9 8 7 6 5 4 3 2 1
10.40 BSC SQ
BOTTOM VIEW
DIAMETER)
(BALL
0.50
0.45
0.40
DETAIL A
109
72
108
73
1. DIMENSIONS ARE IN MILLIMETERS
2. ACTUAL POSITION OF EACH LEAD
3. CENTER DIMENSIONS ARE NOMINAL.
AND COMPLY WITH JEDEC
STANDARD MS-026-BFB.
IS WITHIN 0.08 OF ITS IDEAL POSITION
WHEN MEASURED IN THE LATERAL
DIRECTION.
0.12 MAX (BALL
COPLANARITY)
BSC
0.80
TYP
SEATING
PLANE
ADSP-21261

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