FWIXC1100BD Intel, FWIXC1100BD Datasheet - Page 23

• Manufacturer Part Number: FWIXC1100BD
• Manufacturer: Intel

Specifications of FWIXC1100BD

• Core Operating Frequency: 533MHz
• Package Type: BGA
• Pin Count: 492
• Mounting: Surface Mount
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

General Hardware Design Considerations—Intel
plane processors
Figure 4.
December 2007
Document Number: 252817-008US
Figure 4
interfaces to one bank (2 Chips) of the PC133 SDRAM using the 8 M x 16 (128-Mbit),
16 M x 16 (256-Mbit), or 32 M x 16 (512-Mbit).
Single Bank SDRAM System Block Diagram (x16 Devices)
IXP42X Product Line and
IXC 1100 Control Plane
illustrates how the IXP42X product line and IXC1100 control plane processors’
Processors
SDM_ADDR[12:0]
SDM_DATA[31:0]
SDM__DQM[3:0]
SDM_CS_N[1:0]
Intel
SDM_CLKOUT
SDM_BA[1: 0]
SDM_RAS_N
SDM_CAS_N
SDM_WE_N
®
SDM_CKE
Intel
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
®
IXP42X product line and IXC1100 control
SDM_DQM[1:0]
SDM_CS_N0
SDM_DQM[3:2]
Single BANK
A[12:0]
CS#
RAS#
CAS#
CS#
RAS#
CAS#
DQM[1:0]
DQ[15:0]
A[12:0]
BA[1:0]
SDRAM#1
DQ[15:0]
BA[1:0]
CKE
CLK
WE#
CKE
WE#
SDRAM#2
DQM[1:0]
CLK
Hardware Design Guidelines
System
B2248 -02
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