MCC501RX200TD0B Freescale Semiconductor, MCC501RX200TD0B Datasheet - Page 71

• Manufacturer Part Number: MCC501RX200TD0B
• Manufacturer: Freescale Semiconductor

Specifications of MCC501RX200TD0B

• Package Type: BGA
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Not Compliant

Table 38 C-5 Network Processor Power and Thermal Characteristics (continued)
Notes for
1 Estimated power dissipation (+/-10%) is derived from measurements on the C-5 NP
2 Thermal performance specifications based on following conditions:
PARAMETER
Thermal Resistance, Junction
through Board to Ambient,
φ
Effective Thermal Resistance,
φ
JBA
effective
Revision D00 under following conditions:
•
•
•
•
•
•
•
•
BMU memory operating at 125MHz.
TLU memory operating at 133MHz.
V
“Minimum” P
executing).
“Typical” P
actively running on all CPs.
“Maximum” P
high-bandwidth communications application executing on all CPs, FP, and XP.
Printed circuit board is based on the C-Ware Development System’s C-5 NP Switch
Module reference design, with specifications of:
– 14 total layers (5 planes). Planes at least 100mm x 100mm below the C-5 NP
– FR4 board material, Cu signal and plane material.
– 0.5mils signal layer thickness, 1.4mils plane layer thickness.
– Thermal resistance, board to ambient (φ
Custom heat sink design has the following characteristics:
DD
Table
before any interruptions.
= 1.8V, V
38:
D
based on test application that implements Fast Ethernet forwarding
DD33
D
D
based on idle condition (clocks running and no programs
based on projected maximum consumption for any
= 3.3V, T
MIN
J
at approximately 50
TYP
6.0
1.43
MAX
BA
Power and Thermal Characteristics
UNITS
o
C/W
) of 1.2
o
C.
o
TEST CONDITIONS
See Note 2
See Note 3
C/W.
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