MT9HTF6472FY-667D5E4 Micron Technology Inc, MT9HTF6472FY-667D5E4 Datasheet
MT9HTF6472FY-667D5E4
Specifications of MT9HTF6472FY-667D5E4
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MT9HTF6472FY-667D5E4 Summary of contents
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... PDF: 09005aef81a2f1eb htf9c64_128x72fy.pdf - Rev. C 12/09 EN Products and specifications discussed herein are subject to change by Micron without notice. 512MB, 1GB (x72, SR) 240-Pin DDR2 SDRAM FBDIMM Figure 1: 240-Pin FBDIMM (MO-256 R/C A) Module height: 30.35mm (1.19in) Options • Package – 240-pin DIMM (Pb-free) • Frequency/CAS latency – ...
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... Table 3: Part Numbers and Timing Parameters – 512MB 1 Base device: MT47H64M8, 512Mb DDR2 SDRAM Module 2 Part Number Density MT9HTF6472FY-80E__ 512MB MT9HTF6472FY-667__ 512MB MT9HTF6472FY-53E__ 512MB Table 4: Part Numbers and Timing Parameters – 1GB 1 Base device: MT47H128M8, 1Gb DDR2 SDRAM Module 2 Part Number Density MT9HTF12872FY-80E__ 1GB ...
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Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin FBDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol PN3 PN3 ...
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... M_TEST The M_TEST pin provides an external connection for testing the margin of V duced by a voltage divider on the module not intended to be used in normal system operation and must not be connected (DNU system. This test pin may have other fea- tures on future card designs and will be included in this specification at that time. ...
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... System Block Diagram Commodity DDR2 DDR2 SDRAM component devices DDR2 component DDR2 component DDR2 component modules AMB • • • DDR2 component DDR2 component DDR2 component DDR2 component SMBus access to buffer registers Micron Technology, Inc. reserves the right to change products or specifications without notice. ...
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Functional Block Diagram Figure 3: Functional Block Diagram CS0# DQS0 DQS0# DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1 DQS1# DM5 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS2 DQS2# DM2 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 ...
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... Electrical Specifications Stresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other condi- tions outside those indicated in the device data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ...
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... For all other AMB-related DC parameters, please refer to the high-speed differential link Table 9: Clock Rates FBDIMM Link Data Rate 3.2 Gb/s 4.0 Gb/s 4.8 Gb/s 1. DDR2 components may exceed the listed module speed grades; module may not be avail- Note: I Conditions and Specifications DD Table 10: I ...
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Table 10: I Conditions (Continued) DD Symbol Condition I Active power, data pass through: L0 state; 50% DRAM bandwidth to downstream DD_ACTIVE_2 DIMM; 67% READ; 33% WRITE; Primary and secondary channels enabled; DDR2 SDRAM clock active; CKE HIGH; Command and ...
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Table 15: I Specifications – 1GB DDR2-667 DD Symbol I DD_IDLE_0 I 2600 CC I 1060 DD Total power 6.1 Table 16: I Specifications – 1GB DDR2-800 DD Symbol I DD_IDLE_0 I TBD CC I TBD DD Total power TBD ...
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Table 18: Serial Presence-Detect EEPROM AC Operating Conditions (Continued) Parameter/Condition SDA and SCL rise time SCL clock frequency Data-in setup time Start condition setup time Stop condition setup time WRITE cycle time 1. To avoid spurious start and stop conditions, ...
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... TYP 66.68 (2.63) Front view with heat spreader Back view with heat spreader U7 U8 U10 U9 additional design dimensions. times occur. 12 Module Dimensions 0.75 (0.03 2.0 (0.079) TYP U5 30.5 (1.201) 30.2 (1.189) 17.3 (0.681) TYP 9.5 (0.374) TYP 3.9 (0.153) TYP (x2) Pin 120 45° ...