CY28RS480ZXC Cypress Semiconductor Corp, CY28RS480ZXC Datasheet - Page 7

• Manufacturer Part Number: CY28RS480ZXC
• Description: IC CLOCK GENERATOR 56-TSSOP
• Manufacturer: Cypress Semiconductor Corp
• Type: Clock Generatorr

Specifications of CY28RS480ZXC

• Frequency - Max: 200MHz
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-TSSOP II
• Frequency-max: 200MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output: -
• Input: -

Document #: 38-07638 Rev. *C
Table 4. Crystal Recommendations
Crystal Recommendations
The CY28RS480 requires a Parallel Resonance Crystal.
Substituting a series resonance crystal will cause the
CY28RS480 to operate at the wrong frequency and violate the
ppm specification. For most applications there is a 300-ppm
frequency shift between series and parallel crystals due to
incorrect loading.
Crystal Loading
Crystal loading plays a critical role in achieving low ppm perfor-
mance. To realize low ppm performance, the total capacitance
the crystal will see must be considered to calculate the appro-
priate capacitive loading (CL).
Figure 1 shows a typical crystal configuration using the two
trim capacitors. An important clarification for the following
discussion is that the trim capacitors are in series with the
crystal not parallel. It’s a common misconception that load
capacitors are in parallel with the crystal and should be
approximately equal to the load capacitance of the crystal.
This is not true.
Calculating Load Capacitors
In addition to the standard external trim capacitors, trace
capacitance and pin capacitance must also be considered to
correctly calculate crystal loading. As mentioned previously,
the capacitance on each side of the crystal is in series with the
crystal. This means the total capacitance on each side of the
crystal must be twice the specified crystal load capacitance
(CL). While the capacitance on each side of the crystal is in
14.31818 MHz
Frequency
(Fund)
Figure 1. Crystal Capacitive Clarification
Cut
AT
Loading Load Cap
Parallel
20 pF
0.1 mW
(max.)
Drive
Shunt Cap
series with the crystal, trim capacitors (Ce1,Ce2) should be
calculated to provide equal capacitive loading on both sides.
As mentioned previously, the capacitance on each side of the
crystal is in series with the crystal. This mean the total capac-
itance on each side of the crystal must be twice the specified
load capacitance (CL). While the capacitance on each side of
the crystal is in series with the crystal, trim capacitors
(Ce1,Ce2) should be calculated to provide equal capacitance
loading on both sides.
Use the following formulas to calculate the trim capacitor
values for Ce1 and Ce2.
CL ....................................................Crystal load capacitance
CLe ......................................... Actual loading seen by crystal
using standard value trim capacitors
Ce ..................................................... External trim capacitors
Cs ..............................................Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
CL ....................................................Crystal load capacitance
CLe ......................................... Actual loading seen by crystal
using standard value trim capacitors
Ce ..................................................... External trim capacitors
Cs ..............................................Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
(max.)
5 pF
CLe
Cs1
Total Capacitance (as seen by the crystal)
=
Motional
0.016 pF
Figure 2. Crystal Loading Example
(max.)
Ce1
(
Load Capacitance (each side)
Ce1 + Cs1 + Ci1
X1
Ci1
Ce = 2 * CL – (Cs + Ci)
Clock Chip
1
XTAL
Tolerance
35 ppm
(max.)
Ci2
+
X2
1
Ce2
Ce2 + Cs2 + Ci2
Stability
CY28RS480
30 ppm
(max.)
Cs2
1
3 to 6p
33pF
Pin
Trim
Page 7 of 15
Trace
2.8pF
Aging
(max.)
5 ppm
)
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