SI5368C-C-GQ Silicon Laboratories Inc, SI5368C-C-GQ Datasheet - Page 75

• Manufacturer Part Number: SI5368C-C-GQ
• Description: IC CLK MULTIPLIER ATTEN 100TQFP
• Manufacturer: Silicon Laboratories Inc

Specifications of SI5368C-C-GQ

• Package / Case: 100-TQFP, 100-VQFP
• Input: *
• Output: *
• Frequency - Max: *
• Voltage - Supply: *
• Operating Temperature: *
• Mounting Type: Surface Mount
• Frequency-max: *
• Number Of Circuits: 1
• Maximum Input Frequency: 710 MHz
• Minimum Input Frequency: 0.002 MHz
• Output Frequency Range: 0.002 MHz to 346 MHz
• Supply Voltage (max): 2.75 V
• Supply Voltage (min): 1.71 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.8 V, 2.5 V
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: TQFP
• Pin Count: 100
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Notes (General):
Notes (Solder Mask Design):
Notes (Stencil Design):
Notes (Card Assembly):
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the center
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
(LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
used to assure good solder paste release.
ground pad.
Small Body Components.
Dimension
GE
GD
ZD
E2
D2
ZE
R1
R2
E
D
X
Y
e
Table 7. PCB Land Pattern Dimensions
Preliminary Rev. 0.41
13.90
13.90
3.90
3.90
MIN
—
—
—
—
15.40 REF.
15.40 REF.
0.50 BSC.
1.50 REF.
0.15 REF
16.90
16.90
MAX
4.10
4.10
0.30
1.00
—
—
Si5368
75