CY7C65640A-LFC Cypress Semiconductor Corp, CY7C65640A-LFC Datasheet - Page 21

• Manufacturer Part Number: CY7C65640A-LFC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C65640A-LFC

• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.15V
• Operating Supply Voltage (max): 3.45V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / RoHS Status: Not Compliant

Note. The bottom metal pad size varies by product due to die
size variable. If metal pad design or dimension are critical with
your board designs, contact a Cypress Sales office to get the
specific outline option.
Quad Flat Package No Leads (QFN) Package Design
Notes
The QFN (Quad Flatpack No Leads), being a lead free package,
the electrical contact of the part to the printed circuit board (PCB)
is made by soldering the lands on the bottom surface of the
package to the PCB. Hence special attention is required for the
heat transfer area below the package to provide a good thermal
bond to the circuit board. A Copper (Cu) fill should be designed
into the PCB as a thermal pad under the package. Heat is trans-
ferred from the TetraHub through the device’s metal paddle on
the bottom side of the package. Heat from here is conducted to
the PCB at the thermal pad. It is then conducted from the thermal
pad to the PCB inner ground plane by a 5 x 5 array of via. A via
is a plated through-hole in the PCB with a finished diameter of
13 mil. The QFN’s metal die paddle must be soldered to the
PCB’s thermal pad. Solder mask is placed on the board top side
over each via to resist solder flow into the via. The mask on the
top side also minimizes outgassing during the solder reflow
process.
Document #: 38-08019 Rev. *M
LASER MARK
PIN 1 DOT
1.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.162G
4. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1
4
HATCH AREA IS SOLDERABLE EXPOSED METAL.
1
1
5
5
6
TOP VIEW
8.000±0.100
4
3
2
8
Figure 8. 56-Pin Sawn QFN (8X8X1.0 mm)
4
2
2
9
SIDE VIEW
Follow the layout guidelines provided in the PCB layout files
accompanied with the CY4602 TetraHub Reference Design Kit.
The information in this section was derived from the original
application note by the package vendor. For further information
on this package design, refer to the application note on Surface
Mount
Technology. You can find this on Amkor’s website at this URL:
http://www.amkor.com/products/notes_papers/MLF_AppNote.
This application note provides detailed information on board
mounting guidelines, soldering flow, rework process, and so on.
Figure 9
the package. The cross section is of only one via. The solder
paste template needs to be designed to enable at least 50
percent solder coverage. The thickness of the solder paste
template should be 5 mil. It is recommended that ‘No Clean’, type
3 solder paste is used for mounting the part. Nitrogen purge is
recommended during reflow.
0
0.900±0.100
0.200 REF.
+0.05
-0
on page 22 displays a cross-sectional area underneath
Assembly
0.400±0.100
0.25
+0.05
-0.07
2
9
4
2
2
8
4
3
of
SOLDERABLE
Amkor’s
EXPOSED
6.500±0.100
BOTTOM VIEW
6.100 REF
PAD
0.50 PITCH
MicroLeadFrame
51-85187 *E
CY7C65640A
5
6
1
5
1
1
4
Page 21 of 24
0.45 REF
R 0.20
(MLF)
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