DSP56303VF100 Freescale, DSP56303VF100 Datasheet - Page 22
DSP56303VF100
Manufacturer Part Number
DSP56303VF100
Description
Manufacturer
Freescale
Datasheet
1.DSP56303VF100.pdf
(108 pages)
Specifications of DSP56303VF100
Device Core Size
24b
Format
Fixed Point
Clock Freq (max)
100MHz
Mips
100
Device Input Clock Speed
100MHz
Ram Size
24KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Not Compliant
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Specifications
2.3 Thermal Characteristics
2.4 DC Electrical Characteristics
2-2
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Thermal characterization parameter
Notes:
Supply voltage
Input high voltage
•
•
•
Input low voltage
•
•
•
Input leakage current
High impedance (off-state) input current (@ 2.4 V / 0.4 V)
Output high voltage
•
•
Output low voltage
•
•
Internal supply current
•
•
•
PLL supply current
Input capacitance
D[0–23], BG, BB, TA
MOD
JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
D[0–23], BG, BB, TA, MOD
All JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
TTL (I
CMOS (I
TTL (I
CMOS (I
In Normal mode
In Wait mode
In Stop mode
1
OH
OL
/IRQ
1.
2.
3.
4.
8
8
OH
OL
= 1.6 mA, open-drain pins I
= –0.4 mA)
1
Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per
JEDEC Specification JESD51-3.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that
the cold plate temperature is used for the case temperature.
These are simulated values. See note 1 for test board conditions.
These are simulated values. The test board has two 2-ounce signal layers and two 1-ounce solid ground planes internal to the
test board.
, RESET, PINIT/NMI and all
= 10 µA)
= –10 µA)
3
4
Characteristic
5
2
:
5,7
5
5
Characteristics
1
/IRQ
2
1
, RESET, PINIT
1
OL
= 6.7 mA)
Table 2-3.
Table 2-2.
DSP56303 Technical Data, Rev. 11
5,7
R
R
Symbol
θJA
θJC
Ψ
or θ
or θ
JT
DC Electrical Characteristics
Thermal Characteristics
JA
JC
TQFP Value
Symbol
I
V
V
V
V
V
V
I
V
I
CCW
I
C
V
V
CCS
I
CCI
TSI
56
11
IHP
IHX
CC
ILP
ILX
IN
OH
OL
7
IH
IN
IL
V
0.8 × V
CC
Min
–0.3
–0.3
–0.3
–10
–10
2.0
2.0
2.4
3.0
—
—
—
—
—
—
—
– 0.01
MAP-BGA
CC
Value
6
57
15
8
3
Typ
127
100
3.3
7.5
—
—
—
—
—
—
—
—
—
—
—
—
—
1
Freescale Semiconductor
MAP-BGA
Value
28
—
—
0.2 × V
Max
5.25
0.01
V
V
3.6
0.8
0.8
0.4
2.5
10
10
10
—
—
—
—
—
CC
CC
4
CC
°
°
°
Unit
C/W
C/W
C/W
Unit
mA
mA
mA
µA
µA
µA
pF
V
V
V
V
V
V
V
V
V
V
V