PIC16F721T-I/SS Microchip Technology, PIC16F721T-I/SS Datasheet - Page 194

• Manufacturer Part Number: PIC16F721T-I/SS
• Description: 7 KB FLASH, 256 B SRAM, 18 I/O 20 SSOP .209in T/R
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F721T-I/SS

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC16F/LF720/721
23.5
DS41430A-page 194
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C  T
Param
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
No.
2: T
3: T
P
Thermal Considerations
DD
INTERNAL
A
J
T
Sym.
P
P
JMAX
= Junction Temperature


PD
= Ambient Temperature
DER
is current to run the chip alone without driving any load on the output pins.
JC
I
JA
/
O
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to
Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
Characteristic
A
 +125°C
108.1
Typ.
62.4
85.2
28.1
24.2
32.2
150
2.5
40
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
PD = P
P
P
V
P
OH
INTERNAL
I
DER
/
O
))
=  (I
= PD
 2010 Microchip Technology Inc.
INTERNAL
OL
= I
MAX
Conditions
* V
DD
(T
OL
+ P
x V
J
) +  (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
-