USB2514B-AEZG Standard Microsystems (SMSC), USB2514B-AEZG Datasheet - Page 68

• Manufacturer Part Number: USB2514B-AEZG
• Description: USB CHIP
• Manufacturer: Standard Microsystems (SMSC)

Specifications of USB2514B-AEZG

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Revision 1.1 (04-26-10)
9.2.1
PACKAGE
SYMBOL
Θ
Ψ
Θ
JC
JA
JT
Package Thermal Specifications
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air. The values provided are based on the package body, die size, maximum power
consumption, 85°C ambient temperature, and 125°C junction temperature of the die.
Use the following formulas to calculate the junction temperature:
USB2512/12i
USB2513/13i
USB2514/14i
(°C/W)
34.2
29.9
0.3
0.5
3.0
3.0
T
P
Θ
Θ
Ψ
T
T
T
SYMBOL
A
J
C
T
JA
JC
JT
Table 9.12 Package Thermal Resistance Parameters
USB2512A/12Ai
36-PIN QFN
(°C/W)
Junction temperature
Power dissipated
Junction-to-ambient-temperature
Junction-to-top-of-package
Junction-to-bottom-of-case
Ambient temperature
Temperature of the bottom of the case
Temperature of the top of the case
36.2
33.4
0.4
0.7
5.1
5.1
Table 9.13 Legend
T
T
T
DATASHEET
J
J
J
= P x Θ
= P x Θ
= P x Ψ
DESCRIPTION
68
USB2512B/12Bi
USB2513B/13Bi
USB2514B/14Bi
(°C/W)
40.1
35.0
0.5
0.7
6.3
6.3
JC
JA
JT
+ T
+ T
+ T
A
T
C
USB2513/13i
USB2514/14i
48-PIN QFN
(°C/W)
31.6
27.6
USB 2.0 Hi-Speed Hub Controller
0.3
0.4
3.0
3.0
(meters/sec)
SMSC USB251x
VELOCITY
Datasheet
0
1
0
1
0
1
-