MCZ33742EGR2 Freescale, MCZ33742EGR2 Datasheet - Page 66

• Manufacturer Part Number: MCZ33742EGR2
• Manufacturer: Freescale

Specifications of MCZ33742EGR2

• Data Rate: 1000Kbps
• Number Of Transceivers: 1
• Standard Supported: CAN 2.0
• Operating Supply Voltage (max): 27V
• Operating Supply Voltage (typ): 5/9/12/15/18/24V
• Operating Supply Voltage (min): 4.5V
• Package Type: SOIC W
• Supply Current: 45mA
• Operating Temperature (max): 125C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 28
• Lead Free Status / RoHS Status: Compliant

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
technical datasheet. The addendum provides thermal performance
information that may be critical in the design and development of system
applications. All electrical, application, and packaging information is
provided in the data sheet.
Packaging and Thermal Considerations
package. There is a single heat source (P), a single junction temperature
(T
one package to another in a standardized environment. This methodology
is not meant to and will not predict the performance of a package in an
application-specific environment. Stated values were obtained by
measurement and simulation according to the standards listed below.
Standards
Table 43. Thermal Performance Comparison
66
33742
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Notes:
J
This thermal addendum is provided as a supplement to the MC33742
The MC33742 is offered in a 28 pin SOICW exposed pad, single die
The stated values are solely for a thermal performance comparison of
), and thermal resistance (R
1.
2.
3.
4.
5.
Thermal Resistance
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
Single layer thermal test board per JEDEC JESD51-3.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
R
R
R
R
θJA
θJB
θJA
θJC
(1),
(2),
(1),
(5)
(2)
(3)
(4)
T
J
=
R
θJA
θJA
).
.
P
[°C/W]
220
41
10
68
Figure 38. Surface Mount for SOIC Wide Body
16.0 mm x 7.5 mm Body
28 Pin SOICW
1.27 mm Pitch
Note For package dimensions, refer to
the 33742 data sheet.
non-Exposed Pad
Analog Integrated Circuit Device Data
EG SUFFIX (PB-FREE)
33742DW
33742EG
28-PIN SOICW
98ASB42345B
DW SUFFIX
0.2
SOICW
28-PIN
Freescale Semiconductor
* All measurements
are in millimeters
1.0
0.2
1.0