MAX2395EGI-T Maxim Integrated Products, MAX2395EGI-T Datasheet - Page 11

• Manufacturer Part Number: MAX2395EGI-T
• Description: RF Wireless Misc WCDMA Quasi-Direct M odulator with VGA an
• Manufacturer: Maxim Integrated Products

Specifications of MAX2395EGI-T

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

It is recommended that the exposed pad be soldered
to a ground plane on the PCB, either directly or through
an array of plated via holes. Soldering the pad to
ground is critical for proper heat dissipation. Use a
solid ground plane wherever possible. Any cutout in the
ground plane may act as a slot radiator and reduce its
shield effectiveness.
Figure 1. 3-Wire SPI/MICROWIRE Serial-Interface Timing Diagram
Figure 2. Register Assignments
MSB
B15
B15
B15
B15
SDATA
B14
B14
B14
B14
SCLK
CS
B13
B13
B13
B13
______________________________________________________________________________________
B12
B12
B12
B12
BIT 15
B11
B11
B11
B11
t
CS
BIT 14
B10
B10
B10
B10
OPERATION CONTROL REGISTER (16 BITS)
RFM DIVIDE RATIO REGISTER (16 BITS)
B9
B9
B9
B9
WCDMA Quasi-Direct Modulator
DATA 16 BITS
B8
B8
B8
B8
B7
B7
B7
B7
20-BIT REGISTER
t
BIT 5
CH
B6
B6
RFR DIVIDE RATIO REGISTER (9 BITS)
B6
B6
with VGA and PA Driver
B5
B5
B5
B5
BIT 4
B4
B4
B4
B4
t
CWL
B3
B3
B3
B3
t
CWH
B2
B2
B2
B2
B1
B1
B1
B1
A1
B0
B0
B0
B0
A0
A3
0
0
0
t
ADDRESS 4 BITS
ES
A2
1
0
0
ADDRESS
ADDRESS
ADDRESS
A1
0
0
1
LSB
A0
0
0
0
11