TGA2525 TriQuint, TGA2525 Datasheet - Page 12

• Manufacturer Part Number: TGA2525
• Description: RF Amplifier 2-18GHz LNA / Gain Block w/AGC
• Manufacturer: TriQuint

Specifications of TGA2525

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1062622

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Component placement and adhesive attachment assembly notes:
Reflow process assembly notes:
Interconnect process assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Organic attachment (i.e. epoxy) can be used in low-power applications.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
• Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3-4 minutes, maximum.
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• Do not use any kind of flux.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
• Devices with small pad sizes should be bonded with 0.0007-inch wire.
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
TGA2525
Part
Ordering Information
Assembly Notes
EAR99
ECCN
Mar 2008 © Rev A
GaAs MMIC Die
Package Style
TGA2525
12