TGA2525 TriQuint, TGA2525 Datasheet - Page 10

• Manufacturer Part Number: TGA2525
• Description: RF Amplifier 2-18GHz LNA / Gain Block w/AGC
• Manufacturer: TriQuint

Specifications of TGA2525

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1062622

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Bond Pad #1
Bond Pad #2
Bond Pad #3
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
1.242
0.390
0.230
0.000
1.351
1.230
Vd2 (Not
RF In
Vg2
used)
Units: millimeters
Thickness: 0.10
Die x,y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
1
2
0.090 x 0.148
0.090 x 0.090
0.125 x 0.100
Mechanical Drawing
3
Mar 2008 © Rev A
Bond Pad #4
Bond Pad #5
Bond Pad #6
4
RF Out
Vd1
Vg1
6
5
TGA2525
1.212
1.131
0.968
0.099
0.100 x 0.125
0.090 x 0.148
0.090 x 0.090
10