MAX2063ETM+T Maxim Integrated Products, MAX2063ETM+T Datasheet - Page 19

• Manufacturer Part Number: MAX2063ETM+T
• Description: RF Amplifier Dual, 50MHz to 1000M Hz High-Linearity, S
• Manufacturer: Maxim Integrated Products

Specifications of MAX2063ETM+T

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

If desired, the user can also program two additional
attenuation states by using the STA_B_1 control bit as a
second I/O pin. These two additional attenuation settings
are useful for software-defined radio applications where
multiple static gain settings are needed to account for
different frequencies of operation, or where multiple
dynamic attenuation settings are needed to account for
different blocker levels (as defined by multiple wireless
standards).
The sequence to be used is:
1)
2)
Table 4. Digital Attenuator Settings (Parallel Control, DA_SP = 0)
Table 5. Programmed Attenuation State Settings for Attenuator 1 (DA_SP = 1)
*Defined by SPI programming bits D8:D27 (see Table 3 for details).
*Defined by SPI programming bits D36:D55 (see Table 3 for details).
Table 6. Programmed Attenuation State Settings for Attenuator 2 (DA_SP = 1)
Power supply
Control lines
STA_A_1
STA_A_2
INPUT
D0_ _
D1_ _
D2_ _
D3_ _
D4_ _
0
1
0
1
0
1
0
1
Dual 50MHz to 1000MHz High-Linearity,
Power-Supply Sequencing
Serial/Parallel-Controlled Digital VGA
STA_B_1
STA_B_2
LOGIC = 0 (OR GROUND)
Disable 16dB attenuator
Disable 1dB attenuator
Disable 2dB attenuator
Disable 4dB attenuator
Disable 8dB attenuator
0
0
1
1
0
0
1
1
Preprogrammed attenuation state 1
Preprogrammed attenuation state 2
Preprogrammed attenuation state 3
Preprogrammed attenuation state 4
Preprogrammed attenuation state 1
Preprogrammed attenuation state 2
Preprogrammed attenuation state 3
Preprogrammed attenuation state 4
The pin configuration of the device is optimized to facili-
tate a very compact physical layout of the device and its
associated discrete components. The exposed pad (EP)
of the device’s 48-pin thin QFN-EP package provides a
low thermal-resistance path to the die. It is important that
the PCB on which the device is mounted be designed
to conduct heat from the EP. In addition, provide the EP
with a low inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PCB, either
directly or through an array of plated via holes.
Table 7 lists typical application circuit component values.
SETTING FOR DIGITAL ATTENUATOR 1*
SETTING FOR DIGITAL ATTENUATOR 2*
Enable 16dB attenuator
Enable 1dB attenuator
Enable 2dB attenuator
Enable 4dB attenuator
Enable 8dB attenuator
Layout Considerations
LOGIC = 1
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