BSP171P L6327 Infineon Technologies, BSP171P L6327 Datasheet

MOSFET P-CH 60V 1.9A SOT-223

BSP171P L6327

Manufacturer Part Number
BSP171P L6327
Description
MOSFET P-CH 60V 1.9A SOT-223
Manufacturer
Infineon Technologies
Series
SIPMOS®r
Datasheet

Specifications of BSP171P L6327

Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
300 mOhm @ 1.9A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
1.9A
Vgs(th) (max) @ Id
2V @ 460µA
Gate Charge (qg) @ Vgs
20nC @ 10V
Input Capacitance (ciss) @ Vds
460pF @ 25V
Power - Max
1.8W
Mounting Type
Surface Mount
Minimum Operating Temperature
- 55 C
Configuration
Single Dual Drain
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.3 Ohm @ 10 V
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
1.9 A
Power Dissipation
1800 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
BSP171P L6327
BSP171PL6327INTR
BSP171PL6327XT
SP000089226
Rev 2.4
SIPMOS
Features
• P-Channel
• Enhancement mode
• Logic level
• Avalanche rated
• dv /dt rated
• Pb-free lead plating; RoHS compliant
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Type
BSP 171 P
®
Small-Signal-Transistor
Package
PG-SOT-223
j
=25 °C, unless otherwise specified
Tape and Reel Information
L6327: 1000 pcs/reel
Symbol Conditions
I
I
E
dv /dt
V
P
T
D
D,pulse
j
AS
GS
tot
, T
stg
T
T
T
I
I
V
di /dt =-200 A/µs,
T
T
D
D
A
A
A
j,max
A
DS
=-1.9 A, R
=-1.9 A,
page 1
=25 °C
=70 °C
=25 °C
=25 °C
=-48 V,
=150 °C
1)
1)
1)
GS
Product Summary
V
R
I
D
=25
DS
DS(on),max
Marking
171P
steady state
-55 ... 150
55/150/56
Value
-1.9
-1.5
-7.6
±20
1.8
PG-SOT-223
70
-6
-1.9
-60
0.3
BSP171P
2007-02-08
Unit
A
mJ
kV/µs
V
W
°C
V
A

Related parts for BSP171P L6327

BSP171P L6327 Summary of contents

Page 1

SIPMOS ® Small-Signal-Transistor Features • P-Channel • Enhancement mode • Logic level • Avalanche rated • dv /dt rated • Pb-free lead plating; RoHS compliant Type Package BSP 171 P PG-SOT-223 Maximum ratings =25 °C, unless otherwise specified ...

Page 2

Parameter Thermal characteristics Thermal resistance, junction - soldering point Thermal resistance, junction - ambient Electrical characteristics Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Gate-source leakage current Drain-source on-state resistance Transconductance 1) Device ...

Page 3

Parameter Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time 2) Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Output charge ...

Page 4

Power dissipation P =f(T ) tot A 2 1 [° Safe operating area =25 ° parameter ...

Page 5

Typ. output characteristics I =f =25 ° parameter -4 Typ. transfer characteristics I ...

Page 6

Drain-source on-state resistance R =f =-1 =-10 V DS(on 500 400 98 % 300 200 typ. 100 0 -60 - [° Typ. capacitances C =f ...

Page 7

Avalanche characteristics parameter: T j(start 0 [µ Drain-source breakdown voltage V =f =-1 mA BR(DSS ...

Page 8

Package Outline SOT-223: Outline Footprint Dimensions in mm Rev 2.4 Packaging Tape page 8 BSP171P 2007-02-08 ...

Page 9

... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...

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