NTD4860NT4G ON Semiconductor, NTD4860NT4G Datasheet - Page 2

MOSFET N-CH 25V 10.4A DPAK

NTD4860NT4G

Manufacturer Part Number
NTD4860NT4G
Description
MOSFET N-CH 25V 10.4A DPAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTD4860NT4G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
7.5 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
25V
Current - Continuous Drain (id) @ 25° C
10.4A
Vgs(th) (max) @ Id
2.5V @ 250µA
Gate Charge (qg) @ Vgs
16.5nC @ 4.5V
Input Capacitance (ciss) @ Vds
1308pF @ 12V
Power - Max
1.28W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.0075 Ohms
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
13 A
Power Dissipation
2 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD4860NT4G
Manufacturer:
ON
Quantity:
12 500
1. Surface--mounted on FR4 board using 1 sq--in pad, 1 oz Cu.
2. Surface--mounted on FR4 board using the minimum recommended pad size.
THERMAL RESISTANCE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
OFF CHARACTERISTICS
ON CHARACTERISTICS (Note 3)
CHARGES AND CAPACITANCES
SWITCHING CHARACTERISTICS (Note 4)
3. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperatures.
Junction--to--Case (Drain)
Junction--to--TAB (Drain)
Junction--to--Ambient – Steady State (Note 1)
Junction--to--Ambient – Steady State (Note 2)
Drain--to--Source Breakdown Voltage
Drain--to--Source Breakdown Voltage
Temperature Coefficient
Zero Gate Voltage Drain Current
Gate--to--Source Leakage Current
Gate Threshold Voltage
Negative Threshold Temperature
Coefficient
Drain--to--Source On Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate--to--Source Charge
Gate--to--Drain Charge
Total Gate Charge
Turn--On Delay Time
Rise Time
Turn--Off Delay Time
Fall Time
Turn--On Delay Time
Rise Time
Turn--Off Delay Time
Fall Time
Parameter
Parameter
(T
J
= 25°C unless otherwise specified)
V
V
V
Symbol
Q
Q
V
GS(TH)
(BR)DSS
R
t
t
(BR)DSS
Q
t
t
d(OFF)
d(OFF)
C
C
I
I
G(TOT)
d(ON)
d(ON)
GS(TH)
C
G(TOT)
Q
Q
GSS
DS(on)
DSS
g
G(TH)
T
OSS
RSS
t
t
t
t
ISS
FS
GS
GD
r
f
r
f
J
/T
/
http://onsemi.com
J
V
V
V
GS
GS
GS
V
V
V
V
V
= 0 V, f = 1.0 MHz, V
V
= 4.5 V, V
= 10 V, V
V
2
DS
GS
V
GS
V
GS
GS
GS
V
I
I
DS
D
D
GS
GS
DS
= 20 V
= 4.5 V
= 15 A, R
= 15 A, R
= 0 V,
= 10 V
= 11.5 V, V
Test Condition
= 4.5 V, V
= 0 V, V
= V
= 0 V, I
= 1.5 V, I
DS
DS
DS
, I
= 15 V, I
D
GS
= 15 V, I
D
G
G
DS
= 250 mA
DS
D
= 250 mA
= 3.0 Ω
= 3.0 Ω
= ±20 V
= 15 A
= 15 V,
= 15 V,
T
T
J
I
I
J
D
D
DS
D
= 125°C
D
= 25°C
= 30 A
= 30 A
= 30 A
= 30 A
= 12 V
R
Symbol
θJC--TAB
R
R
R
θJC
θJA
θJA
Min
1.45
25
1308
21.8
12.2
20.1
15.2
Typ
342
169
4.3
7.1
2.3
21
5.2
6.1
8.9
1.2
3.9
4.7
17
22
48
11
Value
117
3.5
75
3
±100
Max
11.1
16.5
1.0
10
2.5
7.5
mV/°C
mV/°C
°C/W
Unit
Unit
mA
nA
nC
ns
ns
nC
pF
V
V
S

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