DS34S101GN Maxim Integrated Products, DS34S101GN Datasheet - Page 12

• Manufacturer Part Number: DS34S101GN
• Description: Communication ICs - Various Single TDM-Over-Pack et Transport Devices
• Manufacturer: Maxim Integrated Products

8 Package Information
For the latest package outline information and land patterns, go to
DS34S101, DS34S102 and DS34S108 have a 256-lead thermally enhanced chip-scale ball grid array (TECSBGA)
package. The TECSBGA package dimensions are shown in Maxim document 21-0353.
DS34S108 has a 484-lead thermally enhanced ball grid array (TEBGA) package. The TEBGA package dimensions
are shown in Maxim document 21-0365.
9 Thermal Information
Note 1: These numbers are estimates using JEDEC standard PCB and enclosure dimensions.
Rev: 032609
____________________________________________________ DS34S101, DS34S102, DS34S104, DS34S108
Parameter
Target Ambient Temperature Range
Die Junction Temperature Range
Theta Jc (junction to top of case)
Theta Jb (junction to bottom pins)
Theta Ja, Still Air (Note 1)
TECSBGA-256
-40 to 125°C
-40 to 85°C
DS34S101
DS34S102
DS34S104
13.1 °C/W
26.2 °C/W
3.7 °C/W
-40 to 125°C
TEBGA-484
-40 to 85°C
DS34S108
16.1 °C/W
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4.2 °C/W
7.1 °C/W
.
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