PMEG6010CEH,115 NXP Semiconductors, PMEG6010CEH,115 Datasheet - Page 7

SCHOTTKY RECT 60V 1A SOD123F

PMEG6010CEH,115

Manufacturer Part Number
PMEG6010CEH,115
Description
SCHOTTKY RECT 60V 1A SOD123F
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PMEG6010CEH,115

Package / Case
SOD-123 Flat Leads
Voltage - Forward (vf) (max) @ If
660mV @ 1A
Voltage - Dc Reverse (vr) (max)
60V
Current - Average Rectified (io)
1A (DC)
Current - Reverse Leakage @ Vr
50µA @ 60V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Capacitance @ Vr, F
68pF @ 1V, 1MHz
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
60 V
Forward Continuous Current
1 A
Max Surge Current
9 A
Configuration
Single
Forward Voltage Drop
0.66 V
Maximum Reverse Leakage Current
50 uA
Maximum Power Dissipation
830 mW
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4104-2
934061056115
PMEG6010CEH T/R
NXP Semiconductors
11. Soldering
PMEG6010CEH_PMEG6010CEJ_2
Product data sheet
Fig 7. Reflow soldering footprint SOD123F
Fig 8. Reflow soldering footprint SOD323F (SC-90)
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
1.6
0.95
(2 )
1.1
PMEG6010CEH; PMEG6010CEJ
0.50
(2 )
Rev. 02 — 27 March 2007
4.4
2.9
1.6
3.05
2.80
2.10
1.60
4
1 A very low V
0.50
001aab169
1.1 1.2
0.60
F
MEGA Schottky barrier rectifiers
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2007. All rights reserved.
solder lands
solder resist
solder paste
occupied area
7 of 10

Related parts for PMEG6010CEH,115