BAV99,235 NXP Semiconductors, BAV99,235 Datasheet - Page 8

• Manufacturer Part Number: BAV99,235
• Description: DIODE DUAL 100V 215MA H-S SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAV99,235

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 215mA (DC)
• Voltage - Dc Reverse (vr) (max): 100V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Diode Configuration: 1 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.215 A
• Max Surge Current: 4 A
• Configuration: Dual Series
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-5005-2; 933215370235; BAV99 /T3; BAV99 /T3; BAV99,235

NXP Semiconductors
11. Soldering
BAV99_SER
Product data sheet
Fig 10. Reflow soldering footprint BAV99 (SOT23/TO-236AB)
Fig 11. Wave soldering footprint BAV99 (SOT23/TO-236AB)
4.6
3
1.7
2.6
(3×)
0.7
(2×)
1.4
1.4
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 18 November 2010
(2×)
1.2
(3×)
(3×)
3.3
2.9
1.9
0.5
0.6
1
2.2
2.8
4.5
(3×)
0.6
2
preferred transport direction during soldering
High-speed switching diodes
BAV99 series
Dimensions in mm
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
occupied area
sot023_fr
sot023_fw
8 of 14