BAV99,235 NXP Semiconductors, BAV99,235 Datasheet - Page 10

• Manufacturer Part Number: BAV99,235
• Description: DIODE DUAL 100V 215MA H-S SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAV99,235

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Current - Average Rectified (io) (per Diode): 215mA (DC)
• Voltage - Dc Reverse (vr) (max): 100V
• Reverse Recovery Time (trr): 4ns
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Diode Configuration: 1 Pair Series Connection
• Mounting Type: Surface Mount
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.215 A
• Max Surge Current: 4 A
• Configuration: Dual Series
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 0.5 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-5005-2; 933215370235; BAV99 /T3; BAV99 /T3; BAV99,235

NXP Semiconductors
BAV99_SER
Product data sheet
Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70)
Fig 15. Wave soldering footprint BAV99W (SOT323/SC-70)
3.65 2.1
2.35
(3×)
0.6
All information provided in this document is subject to legal disclaimers.
1.425
(3×)
0.55
(3×)
Rev. 8 — 18 November 2010
3
2.65
1.85
2.575
4.6
1.325
2
1
(3×)
0.5
1.3
(2×)
09
1.8
High-speed switching diodes
BAV99 series
Dimensions in mm
direction during soldering
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
preferred transport
solder lands
solder resist
solder paste
occupied area
sot323_fr
solder lands
solder resist
occupied area
sot323_fw
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