CY7C1347G-166AXIT Cypress Semiconductor Corp, CY7C1347G-166AXIT Datasheet - Page 13

CY7C1347G-166AXIT

CY7C1347G-166AXIT

Manufacturer Part Number
CY7C1347G-166AXIT
Description
CY7C1347G-166AXIT
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1347G-166AXIT

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
4.5M (128K x 36)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3.15 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1347G-166AXIT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05516 Rev. *I
C
C
C
Parameter
Parameter
IN
CLK
IO
OUTPUT
OUTPUT
3.3 V I/O Test Load
JA
JC
2.5 V I/O Test Load
Input capacitance
Clock input capacitance
I/O capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
= 50 
= 50 
Description
Description
V
(a)
(a)
V
T
T
= 1.5 V
= 1.25 V
R
R
L
L
= 50 
= 50 
T
V
V
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
OUTPUT
OUTPUT
A
DD
DDQ
3.3 V
2.5 V
= 25 C, f = 1 MHz,
Figure 4. AC Test Loads and Waveforms
= 3.3 V.
= 3.3 V
Including
JIG and
Test Conditions
Test Conditions
Including
scope
JIG and
scope
5 pF
5 pF
(b)
(b)
R = 317 
R = 1667 
R = 351 
R = 1538 
100-pin TQFP
100-pin TQFP
Package
V
30.32
GND
GND
6.85
DDQ
V
Max
DDQ
5
5
5
 1 ns
 1 ns
10%
10%
119-ball BGA
119-ball BGA
Package
34.1
14.0
Max
All input pulses
All input pulses
90%
90%
5
5
7
(c)
(c)
165-ball FBGA
165-ball FBGA
Package
CY7C1347G
20.3
Max
4.6
5
5
7
90%
90%
Page 13 of 24
10%
10%
 1 ns
 1 ns
C/W
C/W
Unit
Unit
pF
pF
pF
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