AD9236BCP-80EB Analog Devices Inc, AD9236BCP-80EB Datasheet - Page 7

• Manufacturer Part Number: AD9236BCP-80EB
• Description: 12-BIT 3V 80 MSPS A-D CONVERTER
• Manufacturer: Analog Devices Inc

Specifications of AD9236BCP-80EB

• Number Of Adc's: 1
• Number Of Bits: 12
• Sampling Rate (per Second): 80M
• Data Interface: Parallel
• Inputs Per Adc: 1 Differential
• Input Range: 2 Vpp
• Power (typ) @ Conditions: 366mW @ 80MSPS
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9236-80
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
ELECTRICAL
ENVIRONMENTAL
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
AVDD
DRVDD
AGND
AVDD
D0 to D11
CLK, MODE
VIN+, VIN–
VREF
SENSE
REFT, REFB
PDWN
Storage Temperature
Operating Temperature Range
Lead Temperature
Junction Temperature
(Soldering 10 sec)
With
Respect to
AGND
DGND
DGND
DRVDD
DGND
AGND
AGND
AGND
AGND
AGND
AGND
Min
–0.3
–0.3
–0.3
–3.9
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–65
–40
Max
+3.9
+3.9
+0.3
+3.9
DRVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
+125
+85
300
150
Unit
V
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
°C
Rev. B | Page 7 of 36
THERMAL RESISTANCE
θ
in still air, in accordance with EIA/JESD51-1.
Table 7.
Package Type
RU-28
CP-32-2
Airflow increases heat dissipation effectively, reducing θ
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θ
soldered to the ground plane for the LFCSP package. There is
an increased reliability of the solder joints, and maximum
thermal capability of the package is achieved with the exposed
paddle soldered to the customer board.
JA
is specified for the worst-case conditions on a 4-layer board
JA
. It is recommended that the exposed paddle be
θ
67.7
32.5
JA
θ
32.71
JC
AD9236
Unit
°C/W
°C/W
JA
. In