AD5620CRM-1 Analog Devices Inc, AD5620CRM-1 Datasheet - Page 23

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AD5620CRM-1

Manufacturer Part Number
AD5620CRM-1
Description
IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,TSSOP,8PIN
Manufacturer
Analog Devices Inc
Series
nanoDAC™r
Datasheet

Specifications of AD5620CRM-1

Design Resources
Single-Ended-to-Differential Converters for Voltage Output and Current Output DACs Using AD8042 (CN0143) Amplitude Control Circuit for AD9834 Waveform Generator (CN0156)
Settling Time
8µs
Number Of Bits
12
Data Interface
DSP, MICROWIRE™, QSPI™, Serial, SPI™
Number Of Converters
1
Voltage Supply Source
Single Supply
Power Dissipation (max)
2.5mW
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Number Of Channels
1
Resolution
12b
Conversion Rate
125KSPS
Interface Type
Serial (3-Wire, SPI, QSPI, Microwire)
Single Supply Voltage (typ)
3V
Dual Supply Voltage (typ)
Not RequiredV
Architecture
Resistor-String
Power Supply Requirement
Single
Output Type
Voltage
Integral Nonlinearity Error
±1LSB
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
3.3V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
MSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the AD5620/
AD5640/AD5660 should have separate analog and digital
sections, each having its own area of the board. If the AD5620/
AD5640/AD5660 are in a system where other devices require
an AGND-to-DGND connection, the connection should be
made at one point only. This ground point should be as close as
possible to the AD5620/AD5640/AD5660.
The power supply to the AD5620/AD5640/AD5660 should be
bypassed with 10 μF and 0.1 μF capacitors. The capacitors
should be as close as physically possible to the device, with the
0.1 μF capacitor ideally right up against the device. The 10 μF
capacitors are the tantalum bead type. It is important that the
0.1 μF capacitor has a low effective series resistance (ESR) and
low effective series inductance (ESI), such as is typical of
common ceramic types of capacitors. This 0.1 μF capacitor
provides a low impedance path to ground for high frequencies
caused by transient currents due to internal logic switching.
Rev. F | Page 23 of 28
The power supply line itself should have as large a trace as
possible to provide a low impedance path and reduce glitch
effects on the supply line. Clocks and other components with
fast switching digital signals should be shielded from other
parts of the board by digital ground. Avoid crossover of digital
and analog signals if possible. When traces cross on opposite
sides of the board, ensure that they run at right angles to each
other to reduce feedthrough effects on the board. The best
board layout technique is the microstrip technique, where the
component side of the board is dedicated to the ground plane
only and the signal traces are placed on the solder side.
However, this is not always possible with a 2-layer board.
AD5620/AD5640/AD5660

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