TFDU4101-TT3 Vishay, TFDU4101-TT3 Datasheet - Page 8

• Manufacturer Part Number: TFDU4101-TT3
• Description: Infrared Transceivers SIR 115.2kbits Top View
• Manufacturer: Vishay

Specifications of TFDU4101-TT3

• Wavelength: 900 nm
• Continual Data Transmission: 115.2 Kbit/s
• Radiant Intensity: 65 mW/sr
• Half Intensity Angle Degrees: 24 deg
• Pulse Width: 2.2 us
• Maximum Rise Time: 100 ns, 300 ns
• Maximum Fall Time: 100 ns, 300 ns
• Operating Voltage: 2.4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Dimensions: 9.7 mm x 4.7 mm x 4 mm
• Data Rate Max: 115.2Kbps
• Data Transmission Distance: 1m
• Peak Wavelength: 900nm
• Supply Current: 90µA
• Supply Voltage Range: 2.4V To 5.5V
• Operating Temperature Range: -30°C To +85°C
• Msl: MSL 4 - 72 Hours
• Data Rate: 115.2kbs (SIR)
• Idle Current, Typ @ 25° C: 75µA
• Link Range, Low Power: 1m
• Operating Temperature: -30°C ~ 85°C
• Orientation: Top View
• Shutdown: *
• Size: 9.7mm x 4.7mm x 4mm
• Standards: IrPHY 1.0
• Supply Voltage: 2.4 V ~ 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

TFDU4101
Vishays Semiconductors
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU4101 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown below in
figure 5 and 6 are Vishay's recommended profiles for use
with the TFDU4101 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However,
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
www.vishay.com
8
19535
Fig. 4 - Recommended Solder Profile for Sn/Pb Soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
(3.0-4.0)
0
for
2 to 4 °C/s
Ag
50
(0.5-0.9)
a
100
production
Cu, there are two standard reflow
[e-mail], [e-mail],
160 °C max.
120 to180 s
240 °C max.
150
Time/s
For technical questions within your region, please contact one of the following:
2 to 4 °C/s
200
process
90 s max.
10 s max. at 230 °C
250
Infrared Transceiver Module (SIR, 115.2 kbit/s)
it
300
cannot
350
be
for IrDA
®
TFDU Fig3
Applications
19532
280
240
200
160
120
275
250
225
200
175
150
125
100
80
40
75
50
25
0
0
0
0
Fig. 5 - Solder Profile, RSS Recommendation
[e-mail]
2 °C/s to 3 °C/s
50
50
T ≥ 217 °C for 70 s max.
Fig. 6 - RTS Recommendation
T ≥ 255 °C for 10 s....30 s
T
peak
100
1.3 °C/s
Peak temperature T
100
90 s to 120 s
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
= 260 °C max.
150
Time/s
Time/s
150
200
Document Number: 81288
peak
200
70 s max.
30 s max.
< 4 °C/s
= 260 °C
250
Rev. 1.5, 08-Jul-09
< 2 °C/s
T
250
peak
2 °C/s to 4 °C/s
300
= 260 °C
300
350