87782-2001 Molex Inc, 87782-2001 Datasheet - Page 6

• Manufacturer Part Number: 87782-2001
• Description: CONN SOCKET MINIDIMM VERT SMD
• Manufacturer: Molex Inc
• Series: 87782r

Specifications of 87782-2001

• Connector Style: MiniDIMM
• Number Of Positions: 244
• Memory Type: DDR 2 SDRAM
• Standards: MO-244
• Mounting Type: Surface Mount
• Features: Board Guide, Latches
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Connector Type: DIMM Socket
• No. Of Contacts: 244
• Pitch Spacing: 0.6mm
• Contact Material: Copper
• Contact Plating: Gold
• Contact Termination: Surface Mount Vertical
• Current Rating: 0.5A
• Pitch: 0.6 mm
• Number Of Positions / Contacts: 244
• Mounting Style: SMD/SMT
• Mounting Angle: Vertical
• Housing Material: Thermoplastic, High Temperature
• Voltage Rating: 30 V
• Body Material: LCP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Mounting Feature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 087782-2001; 087782-2001-E; 0877822001; 0877822001-E; 87782-2001-E; 877822001; 877822001-E; WM23938

PRODUCT SPECIFICATION
8.0 OTHER INFORMATIONS
8.1 Reflow Profile.
(Tin Version)
260+0/-5 °C
250°C
Notes :
1. Reflow solder Preheat at 3°C/s to 150°C.
2. Reflow at 250°C for 30s per figure.
3. Peak to be at 260 +0/-5°C
4. Component must withstand (2) reflow solder cycles with a cool down between.
REVISION: ECR/ECN INFORMATION:
TITLE:
SHEET No.
VERTICAL MINI DIMM CONNECTOR
S2008-0204
EC No:
B1
6
6
200/244 CKT, 0.60MM PITCH
of
DATE:
2007/09/12
DOCUMENT NUMBER:
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-87782-027
ATSEE 2007/09/12
SKANG 2007/09/20
MLONG 2007/09/20
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC