APDS-9003-022 Avago Technologies US Inc., APDS-9003-022 Datasheet - Page 9

• Manufacturer Part Number: APDS-9003-022
• Description: IC PHOTOSENSOR AMBIENT 6CHIPLED
• Manufacturer: Avago Technologies US Inc.
• Type: Ambient Light Photo Sensorr

Specifications of APDS-9003-022

• Package / Case: 6-ChipLED - 1.60mm L x 1.50mm W x 0.55mm H
• Wavelength: 620nm
• Output Type: Analog
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 2: Recommended Land Pattern
Appendix A: SMT Assembly Application Note
1.0
Figure 1: Stencil and PCBA
1.1 Recommended Land Pattern
9
Solder
Mask
Stencil
Aperture
0.45
Solder Pad, Mask and Metal Stencil Aperture
0.2
C L
0.4
0.3
0.4
Metal Stencil
For Solder
Paste
Printing
Pattern
Land
PCBA
0.9
0.4
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick
stencil be used for solder paste printing. Aperture opening
for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as
per land pattern). This is to ensure adequate printed
solder paste volume and no shorting.
Figure 3: Solder Stencil Aperture
1.3 Adjacent Land Keepout and Solder Mask Areas
Adjacent land keep-out is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area.
The minimum solder resist strip width required to avoid
solder bridging adjacent pads is 0.2 mm.
Note: Wet/Liquid Photo-Imageable solder resist/mask is
recommended.
Figure 4: Adjacent Land Keepout and Solder Mask Areas
1.7
Mounting
Center
Unit:
mm
Aperture
Opening
Unit: mm
2.6
0.2 MIN.
1.6
0.11
2.