PIC18F46K20-E/P Microchip Technology, PIC18F46K20-E/P Datasheet - Page 7
![IC, 8BIT MCU, PIC18F, 64MHZ, DIP-40](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F46K20-E/P
Manufacturer Part Number
PIC18F46K20-E/P
Description
IC, 8BIT MCU, PIC18F, 64MHZ, DIP-40
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(456 pages)
3.PIC18F26K20-ISS.pdf
(6 pages)
4.PIC18F26K20-ISS.pdf
(10 pages)
Specifications of PIC18F46K20-E/P
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
1024Byte
Ram Memory Size
3936Byte
Cpu Speed
64MHz
No. Of Timers
4
Core Size
8 Bit
Program Memory Size
32768 Words
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 14 Channel
Package
40PDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPDM164124 - KIT STARTER FOR PIC18F4XK20
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F46K20-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
APPENDIX A:
Rev A Document (9/2008)
Initial release of this document.
Rev B Document (5/2009)
Updated Errata to new format.
Added Module 5. MSSP Master I
Module 6. EUSART; Added Module 12. ADC.
Clarifications/Corrections to the Data Sheet:
Removed Modules 1-3.
Rev C Document (6/2009)
Revised Table 1: Silicon DEVREV Values.
Clarifications/Corrections to the Data Sheet: Added
Module 1: Electrical Specifications; Added Module 2:
Electrical Specifications; Added Module 3 MSSP: Reg-
ister 17-3 SSPADD; Added Module 4 MSSP: Section
17.4.2 Operation; Added Module 5 MSSP: Figure 17-
16 MSSP Block Diagram; Added Module 6 MSSP: Sec-
tions 17.4.7.1, 17.4.8, 17.4.9, 17.4.17.1, 17.4.17.2,
17.4.17.3: SSPADD, changing <6:0> to <7:0>.
Rev D Document (3/2010)
Silicon Errata Issues: Added Module 13; Updated Table
2.
Data Sheet Clarifications:
Removed Modules 1-6.
Rev E Document (7/2010)
Removed ADC Work around #2 and changed #3 to #2
(Module 12).
2010 Microchip Technology Inc.
DOCUMENT
REVISION HISTORY
2
C Mode; Added
PIC18F26K20/46K20
DS80404E-page 7