FPF1108 Fairchild Semiconductor, FPF1108 Datasheet - Page 13

• Manufacturer Part Number: FPF1108
• Description: IC LOAD MGMT SWITCH P-CH 4-WLCSP
• Manufacturer: Fairchild Semiconductor
• Series: IntelliMax™r
• Type: High Side Switchr

Specifications of FPF1108

• Number Of Outputs: 1
• Rds (on): 55 mOhm
• Internal Switch(s): Yes
• Current Limit: 1.2A
• Voltage - Input: 1.2 V ~ 4 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-WLCSP
• On Resistance (max): 150 mOhms
• Supply Voltage (max): 4 V
• Supply Voltage (min): 1.2 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Maximum Power Dissipation: 1 W
• Mounting Style: SMD/SMT
• Number Of Switches: Single
• Off Time (max): 3.9 us
• On Time (max): 215 us
• Supply Current: 1 uA
• Switch Current (typ): 1 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
Physical Dimensions
Product-Specific Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
PIN A1 AREA
Product
FPF1107
FPF1108
2X
0.05 C
0.03 C
0.50
0.50
BOTTOM VIEW
C
TOP VIEW
Figure 29. 4 Ball, 1.0 x 1.0mm Wafer Level Chip Scale WLCSP Packaging
D
1 2
E
960µm ± 30µm
960um ± 30µm
SEATING PLANE
B
A
(X)±0.018
Ø0.315±0.025
A
4X
0.625
0.539
D
D
B
(Y)±0.018
2X
F
0.06 C
0.005
0.03 C
F
C A B
SIDE VIEWS
960µm ± 30µm
960um ± 30µm
NOTES:
13
E
B. DIMENSIONS ARE IN MILLIMETERS.
D. DATUM C IS DEFINED BY THE SPHERICAL
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
F. FOR DIMENSIONS D, E, X, AND Y SEE
C. DIMENSIONS AND TOLERANCES PER
G. DRAWING FILENAME: MKT-UC004ABrev2.
A. NO JEDEC REGISTRATION APPLIES.
RECOMMENDED LAND PATTERN
ASME Y14.5M, 1994.
CROWNS OF THE BALLS.
±43 MICRONS (539-625 MICRONS).
PRODUCT DATASHEET.
(NSMD PAD TYPE)
0.50
0.50
0.230mm
0.230mm
X
(Ø0.350)
Solder Mask
(Ø0.250)
Cu Pad
0.332±0.018
0.250±0.025
0.230mm
0.230mm
www.fairchildsemi.com
Y