AH118-89PCB900 TriQuint, AH118-89PCB900 Datasheet - Page 13

• Manufacturer Part Number: AH118-89PCB900
• Description: RF Modules & Development Tools 900MHz Eval Brd 20.5dB Gain
• Manufacturer: TriQuint

Specifications of AH118-89PCB900

• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 5 V
• Product: RF Modules
• Maximum Frequency: 900 MHz
• Supply Voltage (max): 6 V
• Supply Current: 160 mA
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1067445

Data Sheet: Rev A 09/21/10
© 2010 TriQuint Semiconductor, Inc.
AH118
¼ Watt, High Linearity InGaP HBT Amplifier
Package Information and Dimensions
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the
4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Mechanical Information
This package is lead-free/Green/RoHS-
compliant.
lead-free (maximum 260 °C reflow
temperature) and leaded (maximum 245
°C
processes. The plating material on the
leads is NiPdAu.
The AH118 will be marked with an
“AH118G” designator with a lot code
marked below the part designator. The
“Y” represents the last digit of the year
the part was manufactured, the “XXX” is
an auto-generated number, and “Z” refers
to a wafer number in a lot batch
have a final plated thru diameter of .25 mm (.010”).
heatsink.
reflow
It is compatible with both
temperature)
soldering
AH118G
YXXX-Z
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