AH118-89PCB900 TriQuint, AH118-89PCB900 Datasheet - Page 12

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AH118-89PCB900

Manufacturer Part Number
AH118-89PCB900
Description
RF Modules & Development Tools 900MHz Eval Brd 20.5dB Gain
Manufacturer
TriQuint
Datasheet

Specifications of AH118-89PCB900

Minimum Operating Temperature
- 40 C
Supply Voltage (min)
5 V
Product
RF Modules
Maximum Frequency
900 MHz
Supply Voltage (max)
6 V
Supply Current
160 mA
Maximum Operating Temperature
+ 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1067445
Data Sheet: Rev A 09/21/10
© 2010 TriQuint Semiconductor, Inc.
AH118
¼ Watt, High Linearity InGaP HBT Amplifier
PC Board Layout
Circuit Board Material: .062” total thickness with a .014”
Getek top RF layer, 4 layers (other layers added for
rigidity), 1 oz copper, Microstrip line details: width =
.026”, spacing = .026” The silk screen markers ‘A’, ‘B’,
‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for
the input and output tuning.
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor.
PCB land pattern has been developed to accommodate
lead and package tolerances.
processes vary from company to company, careful
process development is recommended.
For further technical information, Refer to
Pin Description
Applications Information
Pin
1
2
3
4
Symbol
RF IN
GND
RF OUT
GND PADDLE
Description
RF Input. DC voltage present, blocking cap required
No electrical connection. Provide an isolated or grounded solder pad for mounting integrity
RF Output. DC voltage present, blocking cap required
Multiple vias should be employed to minimize inductance and thermal resistance
Since surface mount
http://www.triquint.com/prodserv/more_info/default.aspx?prod_id=AH118
RF IN
1
The
- 12 of 14
GND
GND
2
4
RF OUT
Connecting the Digital World to the Global Network
3
Disclaimer: Subject to change without notice
®

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