BGA-194-194 OKI METCAL, BGA-194-194 Datasheet

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BGA-194-194

Manufacturer Part Number
BGA-194-194
Description
NOZZLE BGA 19.4MM X 19.4MM
Manufacturer
OKI METCAL
Datasheet

Specifications of BGA-194-194

Tip - Type
Rework
Tip - Size
BGA, 0.76" x 0.76" (19.4mm x 19.4mm)
Tip - Shape
Quad
For Use With/related Products
BGA Rework Systems
Other names
BGA194194
BGA & CSP
Rework System
BGA-3590 Series
CSP-3500 Series
USER GUIDE
Precision Systems for the Electronics Bench
www.metcal.com
P/N 7000-1251, Ver. A , 9/01

BGA-194-194 Summary of contents

Page 1

... BGA & CSP Rework System BGA-3590 Series CSP-3500 Series www.metcal.com USER GUIDE Precision Systems for the Electronics Bench P/N 7000-1251, Ver 9/01 ...

Page 2

... BGA-3500 Series Manual 5/01 ...

Page 3

... Nozzle Selection Chart SECTION X Warranty and Service Addendum A BGA Windows Program manual A1-A12 Addendum B Calibration Procedure B1-B11 ©2001 Delawre Capital Formation, Inc. All Rights Reserved. DOVER and the DOVER logo are registered trademarks of Delaware Capital formation, Inc., a wholly-owned subsidiary of Dover Corporation ...

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... Specifications for the BGA/CSP-3500 Series Rework Systems Rework System Model Base Unit Input Voltage Base Unit Power Consumption Control Unit Input Voltage Control Unit Power Consumption Base Unit Max Source Temperature Bottom-side heater: Control Unit Max Source Temperature from BGA-3582 Micro Oven ...

Page 5

... Pollution degree 2 per IEC 644 • Insulation category II Vision Systems The BGA-3500 systems provide a maximum four-sided view of 46mm x 46mm (1.77” x 1.77”) with a diag- onal overlay on the component corners for improved alignment. The zoom lens magnification has a range of 10X to 50X. ...

Page 6

... The image of the BGA solder balls is overlaid with the image of the PC board pattern. After coarse align- ment, the corners of the image are brought together. The image is then viewed on the high-resolution monitor and fine X, Y and theta adjustment 50X magnification, can be performed using the micrometers ...

Page 7

... After accurate component placement, the board holder is unlocked and transferred to underneath the Micro Oven™. Here, the BGA or Surface Mount Device is subjected zone, full convection reflow profile, specifically tailored to the requirements of that particular PCB, device and solder paste. Accurate duplica- tion of original oven reflow parameters is achieved. ...

Page 8

... Component Pick-up Solenoid – When engaged, the vacuum is set to automatically raise the component after reflow. III. SYSTEM FUNCTIONS BGA/CSP-3500 SYSTEM - Figure 1 (page 7) 17. Vacuum Cup Height Lock – After the lift solenoid has been armed, this knob locks the vacuum cup into position on the component to be removed. ...

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... Figure BGA-3500 Series Manual 5/ ...

Page 10

... Z-Axis. 14. Foot Switch Receptacle - The FS-24 Footswitch connects to this receptacle. Control Unit BGA/CSP-3500 Control Unit Front Panel - Figure 3 (page 9) 11. Airflow Gauge: Measures the airflow out put to the Reflow Head (liters/minute). 12. Main Power Switch 13 ...

Page 11

... Switch must be in the automatic position for correct operation with the software. 15. Time / Thermocouple Switch: Sets the bottom display of the BGA module to read either the tempera- ture of an external thermocouple or time when running or programming profiles. 16. Lock button: Provides lockout feature ...

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... Proceedure.” Reflow Section IMPORTANT: Prior to initial setup of your BGA/CSP-3500, please remove the transportation screw located on the bottom of the BGA-3500 Series Control Unit. Tilt the unit on its side and remove the screw with a Phillips-head screwdriver. 10 BGA-3500 Series Manual 5/01 ...

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... The small diameter silicon hose connects to the fitting marked “VAC “. 5. Plug in the power cords on the BGA/CSP-3500 Main Unit and Control Unit. Set the BGA/CSP-3500 Main power switch, Control Unit power switch and the Monitor power switch to the “on” position. ...

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... A. PLACEMENT When your BGA/CSP-3500 Series Rework System has been completely set up and you are familiar with the functions of the unit, you are ready to place your first component. 1. Ensure that all power switches are in the “ON” position. Push the “Power” button on your monitor so that it is turned on. Make sure that your monitor is set for the correct input that corresponds with your video input connector (i.e. “ ...

Page 15

... This step is recommended because once the corners of the QFP or large BGA are aligned, the center legs or balls of the lead array are aligned automatically. If the image obtained is not a “true” split, and the symmetry appears to be imperfect, the image is not centered ...

Page 16

... Install a vacuum cup onto the vacuum tube in the BGA head assembly. 14. Depress the vacuum solenoid on the top of the BGA head assembly until it “locks” in the down posi- tion. Do not use excessive force. Unlock the “Z” axis locking knob on the front of the BGA head assem- bly so that the vacuum tube moves freely in the “ ...

Page 17

... While unlocked, push the spring-loaded head on the Micro Oven down so that the vacuum cup makes a complete seal on the BGA component which you are removing and then lock the head into place by tightening the “Z” axis locking knob. You will see the vacuum indicator LED illuminate indicating cor- rect position and seal to the top of the component ...

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... Please consult your Metcal representative for more information. Please note: For this operation it is required that you select footswitch operation and use the footswitch. The footswitch selector is located on the back of the BGA/CSP-3500 Base unit, on the left side, next to the placement head. ...

Page 19

... After the head is backed off 1/2”, depress the vacuum solenoid on the top of the BGA head assembly until it “locks” in the down position. Activate the vacuum pump, unlock the spring-loaded Z-axis adjuster on the BGA head assembly and lower the vacuum cup contact with the component to be removed ...

Page 20

... Z-Axis adjuster on the BGA Head Assembly so that the vacuum pad is in contact with the component (with the vacuum pump activated the vacuum LED will illuminate to confirm vacuum seal). ...

Page 21

... This adjustment should be made while the Z-Axis knob on the placement arm is rotated fully clockwise so the placement head is in the fully upward position. • Calibrate the machine. The calibration procedure is thoroughly discussed later in the manual. BGA-3500 Series Manual 5/01 19 ...

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... Problem: The Micro Oven nozzle is not mounting easily into the BGA-3528 Micro Oven Head Assembly. Probable Cause: • The nozzle lock / release lever has not been rotated fully counter-clockwise. • The notch or oval hole on the Nozzle or BGA-NA Nozzle Adapter has not been indexed correctly. 20 BGA-3500 Series Manual 5/01 ...

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... Solution: • Contact your local Metcal representative or Metcal Applications Engineering for instructions on overriding and entering a new security code. 5. Problem: When operating with a CSP nozzle in the Placement mode an error “BGA Head Hot” is dis- played on the computer. Solution: • The vacuum pad may be blocking the air path through the nozzle forcing the head to overheat. Remove the vacuum pad, allow the head to cool and restart the reflow cycle ...

Page 24

... Kapton Tape (Roll) BGA/CSP-3500 BASE UNIT (convection preheater) PART # DESCRIPTION AC-525-PH-SET Heater pair, 500 W, 115V BGA-3000 & CSP-3500 Systems AC-525-PH-SET Heater pair, 500W, 230V BGA-3000 & CSP-3500 Systems 70399330 Heater pair, 200 W, 100V BGA-3000 & CSP-3500 Systems AC-725-PH-SET Heater pair, 750W, 115V BGA-3500 Systems ...

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... Small Vacuum Nozzle 21077 CSP Vacuum Nozzle OPTIONAL ACCESSORIES: BGA / CSP Reflow Nozzles BGA/CSPNozzle Kit: Part Number BGA/CSP-NK BGA REFLOW NOZZLES PART NUMBER INTERNAL DIMENSIONS BGA-194-194 19.4mm x 19.4mm BGA-220-220 22mm x 22mm BGA-228-228 22.8mm x 22.8mm BGA-252-291 25.2mm x 29.1mm BGA-276-276 27.6mm x 27.6mm BGA-315-315 31 ...

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... The application of high viscosity paste flux can be accomplished with Metcal’s flux transfer plates. The flux transfer plates allow for a simple, controlled application of paste flux to the solder balls of a BGA or CSP component. They are available in many sizes and depths. Please contact your local Metcal representative for information and availability ...

Page 27

... Start the program: Double click on BGA icon. If BGA Unit Not Found error message appears on the screen, ensure that BGA-2000 unit is turned on, and RS-232 cable is firmly connected from PC to back of BGA-3000 unit; click OK then select Options. Select Set Com Port and choose a com port connected to BGA unit ...

Page 28

... PCB correctly. There are two kinds of profiles: One is known as module profile that is stored in the memory device inside the BGA module. The other known as Library Profile carries more information and is stored on the user-selected drive of their computer. Any profile can be stored in the preferred location ...

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... Open a profile stored in BGA module: Select File from menu, select Open and choose Module Profile. Select a profile from the list on the pop up dialog window and click OK. First, click here to select either Place Mode or Remove Mode. Click here to pop up the list of profiles and then select a profile from the list ...

Page 30

... All essential functions for the BGA unit can be run from two control panels. One control panel processes the Module Profile (profiles stored in the BGA-3000 module) and the other the Library Profile (profiles stored on the selected floppy or hard drive of computer). To select either control panel, choose View from the menu and click on Control Panel. Select either Access Module Profile or Access Library Profile, or drag an opened profile to the area of the control panel if Mouse Drag & ...

Page 31

... The T.C. probe is typically placed in between the chip and the PCB by the first balls when trying to establish a removal process for BGA for the first time. It can be placed in any other desired location. The vertical, dotted lines are designed to help read the temperature curves easily ...

Page 32

Copy curves: To copy a temperature curve from one graphics file to another requires opening a source graphics display window and a destination graphics display window prior to copying curve (s). Highlight the graphic window and choose Edit from the ...

Page 33

To move time measurement bars: Move the mouse pointer to the top of the time measurement bar, press and hold the left button of the mouse (A black mark representing the timer will appear on the bottom of the bar). ...

Page 34

... Back up the settings stored in the BGA module: To save all of the settings in the BGA module to a file, select File from menu, choose Back-Up Module Profiles, enter password on the pop up window and click OK. Enter the file name on the pop up window and click OK. ...

Page 35

... Select Security on from menu and choose Lock BGA System. Enter password on the pop up window (You will be asked to enter the new password twice if no password has been set) and click OK. The BGA system is unlocked if the BGA system was in the lock mode previously. Otherwise, a dialog window appears and will ask you to select a security level. Click OK to select security level 2 which prohibits the edit function, the skip cycle function and the profile selection function ...

Page 36

... Open a graphics file on the disk. Save the selected profile Save the selected graphics window to the disk. Update or restore the settings of BGA module. Save all of profiles in BGA module to the disk. Restore profiles stored in the disk to BGA module. Print the current graphics window. Preview the graphics window. ...

Page 37

... Locks BGA systems to prevent unauthorized changes. Prevents user form skipping a cycle during the process. Edit password. Select a profile from BGA module or the disk for Control Panel to process. Set the temperature unit of the current window to Celsius or Fahrenheit. Change the attributes of the selected curve Open the graphics window of the current profile window ...

Page 38

... Get information about BGA windows program. Select here to create the BGA manual file in *Microsoft Word format from the optional manual disk. *Note: Microsoft Word is trademark of Microsoft Corporation. Export a window image to Clipboard: Highlight a window to be exported, select Edit from menu and choose Paste Window Image to Clipboard. ...

Page 39

... Calibration Procedure for Fine-Pitch INTRODUCTION: The Fine-Pitch Placer portion of the BGA-3000 Rework System is a precision optical instrument that will provide its user with the ability to accomplish precise, repeatable alignment of component leads or balls with the mating land pattern on the PCB board. Accurate alignment and placement of any component are dependent on the system’ ...

Page 40

Top view of board holder. Arm not shown for clarity. FIG A To place Gun Sight Assembly into board holder as shown above in FIG. A, procede as follows: Loosen black knobs marked C to allow movement of the front ...

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If the images are broken (not continuous) use the split vision adjustment knob to correct and make the image continuous. 10. The circles should appear as one circle and all markings should be even from one side to the ...

Page 42

... Magnification adjustment E. Lamp Position adjustment MATERIAL REQUIRED: 1. PCB Blank, such as OK Ind. PN: 19703 and component such as OK Ind. PN:19385 (BGA-225) 2. Hex wrench set (must include 0.050”, 1/16”, 3/32", 7/64”) (.050” and 3/32” wrench provided with system) 3. ...

Page 43

DWG # Using a 0.05 hex wrench perform tasks A through F. DWG # 3 A. Turn both screws C & D counterclockwise until there is no effect of this action on the screen. (The image does ...

Page 44

B. BEAM SPLITTER (MIRRORED CUBE) ADJUSTMENT 1. Move the Vacuum Head Assembly to the top position and install size 0.4 Vacuum Cup (P/N 19790) onto the vacuum tube. (See DWG # 5 below.) DWG # 5 2. Turn the Z ...

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DWG # 6A DWG # 6b (image on monitor) C. VISION ASSEMBLY ADJUSTMENT DWG # 7 1. Turn the split vision knob (marks on the diagonal line will move toward each other) until the four marks on the diagonal line ...

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Observe position of the screen splitting line on the screen. If the line does not run through the center of the marks or while zooming in and out the screen splitting line moves, perform steps a-f. DWG # 8 ...

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DWG # 10 a. Loosen the top mounting screw. Use 3/32” hex wrench. (See DWG # 11) b. Turn the supporting screw in or out until the diagonal line aligns itself. c. Tighten the top mounting screw. DWG # 11 ...

Page 48

... Remove Gun Sight Calibration Assembly and replace with PCB blank such as OK Ind. PN: 19703. 2. Install adjustable V Block (MPVB) and place component such as OK Ind. PN: 19385 (BGA-225) in the block. Bring down vacuum pick up head until vacuum activates and pick up component from the adjustable V block. Remove component nest from nest holder. ...

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DWG # 14 Do not touch this screw until after you adjust the block height in step D4. ADDENDUM B page 11 ...

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CONTACT INFORMATION AND TECHNICAL SUPPORT Metcal offers quick response technical service. Please contact your nearest Metcal office for technical support: Metcal Headquarters 1530 O‘Brien Drive, Menlo Park, CA 94025, USA Tel: +1 (650) 325 3291 Fax: +1 (650) 325 5932 ...