0915AT43A0026E Johanson Technology Inc, 0915AT43A0026E Datasheet - Page 54

RF CHIP ANTENNA 902 - 928MHZ

0915AT43A0026E

Manufacturer Part Number
0915AT43A0026E
Description
RF CHIP ANTENNA 902 - 928MHZ
Manufacturer
Johanson Technology Inc
Datasheet

Specifications of 0915AT43A0026E

Antenna Type
Chip
Number Of Bands
1
Frequency
902MHz ~ 928MHz
Gain
-1dBi
Termination
Surface Mount
Mounting Type
Surface Mount
Impedance
50ohm
Bandwidth
26MHz
Power Rating
2W
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Vswr
-
Height (max)
-
Other names
0915AT43A0026
0915AT43A0026
0915AT43A0026E
712-1535-2
Q4586071

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
0915AT43A0026E
Quantity:
20
54
C
Metalized substrates may also be patterned to
customer specifications by chemical etching, abrasive
etching, or pattern plating. Please contact the factory
for other types of metallization configurations other than
a continuous top / bottom plating. Other termination
material thicknesses are available upon request.
ALN
Alumina
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
Titanate Based
SUBSTRATE
USTOM
MATERIAL
*
*
S
UBSTRATES
MATERIAL
CODE
W
G
C
K
N
U
R
D
B
Y
F
V
L
X
T
Z
& T
12000
1200
2000
2700
4000
8000
120
160
280
350
600
8.8
9.9
23
37
80
K
HIN
www.johansontechnology.com
www.johansontechnology.com
170 W/M deg K (Th. Cond.)
P120 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
0 +/- 30 ppm / deg C
-750 +/- 120 ppm / deg C
-1500 +/- 300 ppm / deg C
-750 +/- 120 ppm / deg C
-750 +/- 120 ppm / deg C
+/- 10% (-55 to +125 C)
+/- 10% (-55 to +125 C)
+/- 10% (-55 to +125 C)
+/- 15% (-55 to +125 C)
+/- 15% (-55 to +125 C)
+22/-56% (+10 to +85 C)
+22/-82% (-30 to +85 C)
F
ILM
TEMPERATURE
COEFFICIENT
P
RODUCTS
Johanson Technology offers a wide range
of dielectrics for use in application specific
environments. These materials are available
both lapped and “as fired” condition as well
as metalized and non-metalized substrates.
Standard substrate sizes range from 0.50” x
0.50” to 1.50” x 1.50”, with larger sizes available
with special order . Dielectrics are available from
0.005” to 0.050” thick.
Note: When metallization is requested on
both top and bottom sides, the metallization
will wrap around the sides as a standard
unless otherwise specified.
TiW / Ni / Cu / Ni / Au
METALIZATION
Non-Metallized
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
-55 to +125 deg. C
TaN / TiW / Au
TEMPERATURE
80Au / 20 Sn
TiW / Ni / Au
TiW / Ni / Sn
OPERATING
TiW / Au
< 0.15% @ 1 MHz
< 0.15% @ 1 MHz
< 0.15% @ 1 MHz
< 0.25% @ 1 MHz
< 0.25% @ 1 MHz
< 0.25% @ 1 MHz
< 1.50% @ 1 MHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 2.50% @ 1 kHz
< 4.00% @ 1 kHz
< 4.00% @ 1 kHz
DISSIPATION
FACTOR
CODE
N
V
R
C
E
X
T

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