AD8130ARM Analog Devices Inc, AD8130ARM Datasheet - Page 38

• Manufacturer Part Number: AD8130ARM
• Description: IC AMP DIFF LN LDIST 40MA 8MSOP
• Manufacturer: Analog Devices Inc
• Type: Diff Receiverr

Specifications of AD8130ARM

• Slew Rate: 1100 V/µs
• Mounting Type: Surface Mount
• Rohs Status: RoHS non-compliant
• Design Resources: High CMRR Circuit for Converting Wideband Complementary DAC Outputs to Single-Ended Without Precision Resistors (CN0142)
• Amplifier Type: Differential
• Number Of Circuits: 1
• -3db Bandwidth: 290MHz
• Current - Input Bias: 500nA
• Voltage - Input Offset: 400µV
• Current - Supply: 13mA
• Current - Output / Channel: 40mA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 25.2 V, ±2.25 V ~ 12.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• No. Of Amplifiers: 1
• Bandwidth: 270MHz
• No. Of Pins: 8
• Settling Time: 20ns
• Operating Temperature Max: 85°C
• Peak Reflow Compatible (260 C): No
• Number Of Channels: 1
• Number Of Elements: 1
• Power Supply Requirement: Single/Dual
• Common Mode Rejection Ratio: 86dB
• Voltage Gain Db: 71dB
• Unity Gain Bandwidth Product (typ): 110MHz
• Input Resistance: 6@5VMohm
• Input Offset Voltage: 1.8@5VmV
• Input Bias Current: 2@5VnA
• Single Supply Voltage (typ): 5/9/12/15/18/24V
• Dual Supply Voltage (typ): ±3/±5/±9/±12V
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 4.5V
• Single Supply Voltage (max): 25.2V
• Dual Supply Voltage (min): ±2.25V
• Dual Supply Voltage (max): ±12.6V
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: MSOP
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: Not Compliant

AD8129/AD8130
LAYOUT, GROUNDING, AND BYPASSING
The AD8129/AD8130 are very high speed parts that can be
sensitive to the PCB environment in which they operate.
Realizing their superior specifications requires attention to
various details of standard high speed PCB design practice.
The first requirement is for a good solid ground plane that
covers as much of the board area around the AD8129/AD8130
as possible. The only exception to this is that the ground plane
around the FB pin should be kept a few millimeters away, and
the ground should be removed from the inner layers and the
opposite side of the board under this pin. This minimizes the
stray capacitance on this node and helps preserve the gain
flatness vs. frequency.
The power supply pins should be bypassed as close as possible
to the device to the nearby ground plane. Good high frequency
ceramic chip capacitors should be used, and the bypassing
should be done with a capacitance value of 0.01 μF to 0.1 μF for
each supply. Farther away, low frequency bypassing should be
provided with 10 μF tantalum capacitors from each supply to
ground.
The signal routing should be short and direct to avoid parasitic
effects. Where possible, signals should be run over ground
planes to avoid radiating or to avoid being susceptible to other
radiation sources.
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