AD8061ART-REEL7 Analog Devices Inc, AD8061ART-REEL7 Datasheet - Page 6

IC OPAMP VF R-R LP 50MA SOT23-5

AD8061ART-REEL7

Manufacturer Part Number
AD8061ART-REEL7
Description
IC OPAMP VF R-R LP 50MA SOT23-5
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD8061ART-REEL7

Slew Rate
650 V/µs
Rohs Status
RoHS non-compliant
Amplifier Type
Voltage Feedback
Number Of Circuits
1
Output Type
Rail-to-Rail
-3db Bandwidth
320MHz
Current - Input Bias
3.5µA
Voltage - Input Offset
1000µV
Current - Supply
6.8mA
Current - Output / Channel
50mA
Voltage - Supply, Single/dual (±)
2.7 V ~ 8 V, ±1.35 V ~ 4 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
SOT-23-5, SC-74A, SOT-25
Op Amp Type
Voltage Feedback
No. Of Amplifiers
1
Bandwidth
300MHz
Supply Voltage Range
2.7V To 8V
Amplifier Case Style
SOT-23
No. Of Pins
5
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
AD8061ART-REEL7
AD8061ART-REEL7TR

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AD8061/AD8062/AD8063
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common-Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering,
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Specification is for device in free air.
8-lead SOIC (R)
5-lead SOT-23 (RJ)
6-lead SOT-23 (RJ)
8-lead MSOP (RM)
R-8, RM-8, SOT-23-5, SOT-23-6
10 sec)
8-Lead SOIC_N: θ
5-Lead SOT-23: θ
6-Lead SOT-23: θ
8-Lead MSOP: θ
JA
JA
JA
JA
= 200°C/W; θ
= 240°C/W; θ
= 230°C/W; θ
= 160°C/W; θ
1
JC
JC
JC
JC
= 44°C/W.
= 92°C/W.
= 92°C/W.
= 56°C/W.
Rating
8 V
0.8 W
0.5 W
0.5 W
0.6 W
(−V
±V
Observe power derating curves
−65°C to +125°C
−40°C to +85°C
300°C
S
S
− 0.2 V) to (+V
S
+ 0.2 V)
Rev. G | Page 6 of 20
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8061/AD8062/AD8063 is limited by the associated rise in
junction temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure. While the
AD8061/AD8062/AD8063 is internally short-circuit protected,
this may not be sufficient to guarantee that the maximum
junction temperature (150°C) is not exceeded under all
conditions.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
ESD CAUTION
Figure 6. Maximum Power Dissipation vs. Temperature for
2.0
1.5
1.0
0.5
0
–50 –40 –30
8-LEAD SOIC
PACKAGE
MSOP
–20
AD8061/AD8062/AD8063
–10
AMBIENT TEMPERATURE (°C)
SOT-23-5, SOT-23-6
0
10
20
30
40
T
50
J
= 150°C
60
70 80
90

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