MC9S08RD32CDWE Freescale Semiconductor, MC9S08RD32CDWE Datasheet - Page 217
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC9S08RD32CDWE
Manufacturer Part Number
MC9S08RD32CDWE
Description
IC MCU 32K FLASH 2K RAM 28-SOIC
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08RE8FJE.pdf
(234 pages)
Specifications of MC9S08RD32CDWE
Core Processor
HCS08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
S08RD
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
39
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08RG60E
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08RD32CDWE
Manufacturer:
SWAP
Quantity:
6 700
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Freescale Semiconductor
(CPOL = 1)
(CPOL = 0)
(OUTPUT)
(INPUT)
(INPUT)
(INPUT)
(INPUT)
NOTE:
(CPOL = 0)
(CPOL = 1)
MOSI
(OUTPUT)
MISO
SCK
SCK
(INPUT)
(INPUT)
(INPUT)
(INPUT)
NOTE:
1. Not defined but normally MSB of character just received
SS
MISO
MOSI
SCK
SCK
1. Not defined but normally LSB of character just received
SS
SLAVE
<
NOTE
SEE
<
<
<
MSB IN
Figure A-13. SPI Slave Timing (CPHA = 0)
Figure A-14. SPI Slave Timing (CPHA = 1)
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
<
SLAVE
MSB OUT
<
<
<
<st
<
MSB IN
<
<
<
MSB OUT
<
<
<
<
<
<
BIT 6 . . . 1
BIT 6 . . . 1
<s
<st
BIT 6 . . . 1
BIT 6 . . . 1
SLAVE LSB OUT
LSB IN
SLAVE LSB OUT
<s
<st-
LSB IN
<s
Electrical Characteristics
NOTE
SEE
<
<
217
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