STR912FAW44X6 STMicroelectronics, STR912FAW44X6 Datasheet - Page 98

• Manufacturer Part Number: STR912FAW44X6
• Description: MCU 512KB FLASH 96K RAM 128LQFP
• Manufacturer: STMicroelectronics
• Series: STR9r

Specifications of STR912FAW44X6

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 2 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-LQFP
• Processor Series: STR912x
• Core: ARM966E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 96 KB
• Interface Type: CAN, I2C, IrDA, SSP, UART, USB
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR9-COMSTICK, STR910-EVAL, STR91X-SK/HIT, STR91X-SK/IAR, STR91X-SK/KEI, STR91X-SK/RAI, STR9-DK/RAIS, STR91X-DK/IAR, STX-PRO/RAIS, STR912-D/RAIS, STR79-RVDK/CPP, STR79-RVDKCPP/9, STR79-RVDK, STR79-RVDK/9, STR9-RVDK/BAS, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Dc: 1020
• For Use With: 497-8267 - BOARD EVAL BASED ON STR9497-8262 - BOARD EVAL BASED ON STR912FAMCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES497-5067 - BOARD EVAL FOR STR910 FAMILY497-5066 - KIT STARTER KEIL FOR STR910497-5065 - KIT STARTER IAR KICKSTART STR912497-5064 - KIT STARTER FOR STR910 FAMILY497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6284

Package mechanical data
9.1
9.2
98/102
Figure 43. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
ECOPACK
To meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions, and product status are available at www.st.com.
Thermal characteristics
The average chip-junction temperature, T
The average chip-junction temperature, T
following equation:
Where:
●
●
●
●
P
Most of the time for the applications P
P
and/or memories. The worst case P
2.0 V).
An approximate relationship between P
Therefore (solving equations 1 and 2):
Where:
●
I/O
I/O
represents the power dissipation on input and output pins;
may be significant if the device is configured to drive continuously external modules
T
Θ
P
P
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
and T
A
JA
D
INT
is the ambient temperature in ° C,
is the sum of P
is the package junction-to-ambient thermal resistance, in ° C/W,
is the product of I
J
may be obtained by solving equations (1) and (2) iteratively for any value of T
T
P
K = P
J
D
Dpad
Dsm
= T
D
= K / (T
(at equilibrium) for a known T
D
A
x (T
+ (P
INT
J
A
D
and P
+ 273 °C)
DD
+ 273 °C) + Θ
x Θ
and V
Doc ID 13495 Rev 6
JA
I/O
)
INT
(P
DD
I/O
D
, expressed in Watts. This is the Chip Internal Power.
of the STR91xFA is 500 mW (I
D
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
= P
< P
JA
J
and T
J
, in degrees Celsius, may be calculated using the
must never exceed 125 °C.
INT
INT
x P
+ P
D
J
and may be neglected. On the other hand,
2
(if P
A.
I/O
Using this value of K, the values of P
I/O
),
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
(1)
(2)
(3)
is neglected) is given by:
DD
x V
DD
STR91xFAxxx
, or 250 mA x
D
A
.